International Business Machines Corporation

Caitlin W Weinstein

Wolfgang Sauter

Kevin Shawn Petrarca

Richard Paul Volant

Takashi Hisada

Samuel McKnight

David Angell

Frederic Beaulieu

Adreanne Kelly

Hiromitsu Miyai

Timothy Charles Krywanczyk

John Chester Malinowski

Steven Ross Codding

Joseph D Danaher

James R Palmer

Melvin T Kelly

Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

Internally reinforced bond pads

A method of treating a molybdenum (moly) mask used in a C4 process to pattern C4 contacts. The moly mask has a wafer side which contacts a wafer during the C4 process and has a rough surface that includes spikes/projections of moly. The moly mask also has a non wafer side and a plurality of holes extending through the mask to pattern C4 contacts in the C4 process. An adhesive layer, such as an adhesive tape, is applied to the non wafer side of the moly mask, to enable a polishing tool to pull a vacuum on the non wafer side of the moly mask in spite of the presence of the holes to secure the moly mask during a subsequent polishing step. The tape also functions as a cushion so that defects on the non wafer side of the moly mask do not replicate through the moly mask to the polished wafer side of the moly mask. The wafer side of the moly mask is then subjected to mechanical or chemical/mechanical polishing to substantially remove the spikes of moly without significantly altering the dimensions of the moly mask or the holes.

Method of polishing C4 molybdenum masks to remove molybdenum peaks

Growing community of inventors

Cambridge, MA, United States of America

Caitlin W Weinstein