National Semiconductor Corporation

Cade Murray

Luu Thanh Nguyen

Peter Deane

Chen-Hui Tsay

Hem P Takiar

Ranjan J Mathew

Tonya Fridlyand

An improved packaged liquid crystal display (LCD) assembly is described. A recess is used to house a support material while the LCD cellis positioned at least partially within the containment structure. A plurality of spaced apart stabilizers are attached from the sides of the LCD cellto the substrate without transmitting residual stresses induced during fabrication and operation. A support material is dispensed in the recess such that it provides support for the LCD cellwithout transmitting residual stresses from the substrate. The described arrangements permit an LCD assembly which minimizes the amount of forces and stresses that lead to optical defects. The stabilizers, in addition to supporting the cell, also act to contain the encapsulating material used to protect the bonding wires. The support material, in addition to minimizing transmission of stresses, also provides improved heat dissipation from the LCD cell. In another embodiment, a method for constructing the LCD assembly is described.

Liquid crystal display assembly for reducing optical defects

A stacked molded package comprising a semiconductor package attached to an electronic device. The semiconductor package includes a semiconductor die which is connected to a set of wire leads and is encapsulated within a protective molding material. Additionally, solder bumps within the molding material are attached to input and output contact points on the semiconductor die. Portions of the solder bumps are exposed through the surface of the molding material so that contact can be made with the electrical contacts of an electronic device to be stacked upon the semiconductor package. The electronic device may be, for example, another semiconductor die or an opto-electronic transceiver. The present invention also includes a method for manufacturing the stacked molded package. The method involves forming the semiconductor package within a molding chamber which is injected with the protective molding material. The method further involves lowering the top surface of the molding chamber onto the solder bumps of the semiconductor package. The contact between the top surface of the molding chamber and the solder bumps flattens a portion of the solder bumps and prevents the flattened portion from being covered with molding material. Manufacturing the semiconductor package may be performed with the current manufacturing infrastructure which is used to make semiconductor packages according to specific form factors. A stacked package is formed when an electronic device is attached to the molded package.

Arrayable, scaleable, and stackable molded package configuration

A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.

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Fremont, CA, United States of America

Cade Murray