Advanced Micro Devices Corporation

Spansion LLC.

Cabe W Nicksic

Matthew A Purdy

Jason Alan Grover

Edward Christopher Stewart

Susan Hickey

Tony Baker

David Wizelman

A method, apparatus and a system, for provided for performing an automated process flow adjustment. A semiconductor wafer is processed based upon a routing plan and a predetermined schedule. A fault detection relating to the processing of the semiconductor wafer is performed. Dynamically modifying the predetermined routing plan or the predetermined schedule based upon the fault detection. A predetermined process material delivery plan is dynamically modified based upon the modifying of the routing plan or modifying of the predetermined schedule.

Method and apparatus for impasse detection and resolution

The present invention provides a method that includes determining a jeopardy count associated with at least one processing tool and selecting at least one wafer based upon the jeopardy count, the at least one wafer having been processed by the at least one processing tool.

Method and apparatus for scheduling metrology based on a jeopardy count

The present invention is generally directed to various methods and systems for dynamically controlling metrology work in progress. In one illustrative embodiment, the method comprises providing a metrology control unit that is adapted to control metrology work flow to at least one metrology tool, identifying a plurality of wafer lots that are in a metrology queue wherein the wafer lots are intended to be processed in at least one metrology tool, and wherein the metrology control unit selects at least one of the wafer lots for metrology processing in the at least one metrology tool and selects at least one other of the plurality of wafer lots to be removed from the metrology queue based upon the metrology processing of the selected at least one wafer lot in the at least one metrology tool.

Method and system for dynamically selecting wafer lots for metrology processing

A method and apparatus for scheduling work in a semiconductor fabrication facility is provided. The method includes determining a time period associated with processing of at least one wafer, determining at least one due time associated with processing of the at least one wafer, and scheduling the at least one wafer for processing based on the time period and the at least one due time.

Method and apparatus for scheduling work in a fabrication facility

A method includes scheduling a plurality of workpieces for processing by a plurality of tools. Each workpiece has an associated priority. The processing in at least one of the tools is controlled in accordance with a process control model. A process control request associated with the controlling of the tool is generated. The priorities of at least a subset of the workpieces are determined based on the process control request. A manufacturing system includes a plurality of tools for processing workpieces, a dispatch unit, and a process control unit. The dispatch unit is configured to schedule a plurality of workpieces for processing by the tools. Each workpiece has an associated priority. The process control unit is configured to control the processing in at least one of the tools in accordance with a process control model and generate a process control request associated with the controlling of the tool. The dispatch unit is further configured to receive the process control request and determine the priorities of at least a subset of the workpieces based on the process control request.

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Austin, TX, United States of America

Cabe W Nicksic