Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

C H Chen

Chin-Szu Lee

Chun-Chih Lin

Cheng-Yi Wu

Yi-Ming Lin

Jian-Shin Tsai

Chao-Ching Chang

Min-Hui Lin

Wen-Shan Chang

Y T Tsai

W R Chang

Y M Tsui

Y C Chao

An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.

Image sensor having conductive layer and protective layer

A method of fabricating an image sensor includes depositing a first dielectric layer over a substrate, removing a portion of the first dielectric layer from the substrate to form a trench, depositing a conductive layer over the first dielectric layer and in the trench, forming a protective layer lining a top surface of the conductive layer and sidewalls and a bottom surface of the groove in the conductive layer, and removing a portion of the conductive layer to form a grid structure. A groove corresponding to the trench is formed in the conductive layer.

Image sensor and fabrication method therefor

The present invention discloses a via plug formed in a zig-zag bordered opening in a semiconductor structure wherein the film stress in a barrier/glue layer TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling of the TiN layer from the contact opening occurs. The via plug can be formed in a process by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.

Method for forming zig-zag bordered openings in semiconductor structures and structures formed

The present invention discloses a method for forming a zig-zag bordered opening in a semiconductor structure such that the film stress in a barrier/glue layer of TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling-off of the TiN layer from the contact opening occurs. The method can be easily carried out by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.

Method for forming zig-zag bordered openings in semiconductor structures

A swiveling electric fan comprising a truncated sphere-shaped housing which encloses a vane member, and a base having a concave spheric top surface with the same diameter as that of the housing, the housing being connected with the base in a swiveling manner, an upper end of the supporting disk being secured to the housing while a lower end thereof extending into the base to connect with and abut against a rotary guiding disk of a swiveling mechanism in a swiveling manner, so that when the guiding disk rotates, a sleeve section of the supporting disk is rotated in a circular hole of the top surface of the base, the circular hole being larger than the sleeve section in diameter, whereby the vane member is made to swivel through an elliptical trace.

Swinging type of electric fan

A warm mist humidifier wherein the steam-heating means thereof is composed of an outer heating means and an inner heating means having a plurality of oblique blades mounted around its upper periphery. A thin layer of water flowing from a reservoir between said outer heating means and inner heating means is rapidly heated into steam when disposed beneath the steam-heating means a heater is actuated, the ascending steam thrust on the blades to rotate the inner heating means to rub the outer heating means continuously, preventing minerals or other deposits from depositing thereon and permitting the deposits to be carried by hot water to a collector disposed around the outer heating means and there after to a filter means through a groove for filtering, thereby eliminating the disadvantage of usually manual cleaning of the humidifier.

Growing community of inventors

Hsinchu, Taiwan

C H Chen