Visteon Global Technolgoies, Inc.

C Allen Marlow

Jay DeAvis Baker

Lawrence LeRoy Kneisel

Zhong-You Joe Shi

William David Hopfe

Rosa Lynda Nuño

The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

High frequency antenna disposed on the surface of a three dimensional substrate

A non-mechanical fluid level sensor based on light communication channel (LCC) technology. In a preferred embodiment, one end of the LCC is connected to a signal source while another end is connected to a sensor. The LCC is dipped in a fluid container and a signal propagates and undergoes internal reflection through the LCC towards one of its ends which is connected to the sensor. The fluid level is detected preferably by measuring the intensity of the signal reflected with the LCC that reaches a sensor. Different fluid levels preferably correspond to linearly varying detected signal intensities. A main LCC bus may communicate remotely with the sensor without wiring or other electrical connectors.

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Saline, MI, United States of America

C Allen Marlow