Samsung Electronics Co., Ltd.

Byungmin Yu

Junghoon Kang

Junghyun Lee

A semiconductor package includes: a lower redistribution structure including a lower redistribution insulation layer, a bump pad in the lower redistribution insulation layer, and a lower redistribution pattern electrically connected to the bump pad, wherein the lower redistribution insulation layer includes: one or more sidewalls at least partially defining a cavity extending from a bottom surface of the lower redistribution insulation layer to an upper surface of the lower redistribution insulation layer; a passive component in the cavity of the lower redistribution insulation layer; an insulation filler in the cavity of the lower redistribution insulation layer, the insulation filler covering sidewalls of the passive component; a first semiconductor chip on the lower redistribution structure, the first semiconductor chip electrically connected to both the lower redistribution pattern and the passive component; and an external connection bump connected to the bump pad via a pad opening of the lower redistribution insulation layer.

Growing community of inventors

Sejong-si, South Korea

Byungmin Yu