Lg Electronics Inc.

Yonsei University

Skhynix Inc.

Seoul National University

Byungjun Kang

Junghoon Kim

Minpyo Kim

Bojoong Kim

Byoungkwon Cho

Daeseon Hyun

Hyungsuk Lee

Deog-Kyoon Jeong

Jinsung Kim

Hyunjung Park

Chilkeun Park

Wonjae Chang

Hyeyoung Yang

Goohwan Shim

Mihee Heo

Myoungsoo Kim

Junhan Kwon

Joonhan Kwon

Yunhee Lee

Donyoung Kang

Chanryeol Rhyou

Daehyun Koh

Discussed is a display device including a base portion, assembled electrodes extending along one direction on the base portion, a dielectric layer to cover the assembled electrodes, a partition wall portion on the dielectric layer while forming a plurality of cells, and a plurality of semiconductor light emitting diodes seated in the plurality of cells, respectively and to emit light of different colors. The plurality of semiconductor light emitting diodes emitting different colors include recessed portions having different shapes. Further, a surface of the plurality of cells includes a solder portion protruding to correspond to the recessed portions of the plurality of semiconductor light emitting diodes seated in the plurality of cells, respectively.

Display apparatus using semiconductor light-emitting device

An inkjet head device comprises a body comprising light emitting devices, a nozzle installed on a lower side of the body to spray the light emitting devices onto the substrate in units of droplets, and a first guide part disposed in the body to guide the light emitting devices to the nozzle in a line. Since the light emitting devices arranged in a line by the first guide part are dropped on the substrate in units of a predetermined amount of droplets, the number of light emitting devices included in each droplet may be the same or similar. Thus, since the same or similar number of light-emitting elements are disposed or aligned in each sub-pixel, the luminance in each sub-pixel obtained by the light-emitting elements can be uniform.

Inkjet head device

The present invention relates to a method for manufacturing a display device, and more particularly, to a method for manufacturing a display device using a semiconductor light emitting device having a size of several μm to several tens of μm, and to an assembly substrate used for manufacturing the display device. The present invention provides a display device, characterized in that including a substrate having a wiring electrode, a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, and a passivation layer formed to cover the semiconductor light emitting device, and the passivation layer is formed to cover only a portion of a side surface of the semiconductor light emitting device.

Display device using semiconductor light emitting elements, and method for manufacturing same

Discussed is a display device including a base part; a plurality of assembly electrodes disposed on the base part and having a first electrode and a second electrode that generate an electric field when power is applied; a dielectric layer disposed to cover the plurality of assembly electrodes; and a plurality of semiconductor light emitting devices disposed on a surface of the dielectric layer, wherein one surface of the plurality of semiconductor light emitting devices facing the dielectric layer and one surface of the dielectric layer facing the plurality of semiconductor light emitting devices respectively comprise a concave-convex structure.

Display device using micro led

A semiconductor device includes a first switch coupling a first switch coupling a first power source and a first node according to a first control signal; a sense amplifier coupled between the first node and a second node and performing a sensing operation; a second switch coupling a second power source and the second node according to a second control signal; and a sense amplifier control circuit providing the first control signal and the second control signal. The sense amplifier control circuit controls the second control signal so that a voltage of the second node reaches a shift voltage higher than a voltage of the second power source during a first sensing period of the sensing operation and a bias current flows through the second node during a second sensing period of the sensing operation. The sensing period is subsequent to the first sensing period.

Semiconductor device including sense amplifier having enhanced sensing margin and method of controlling the same

Provided is a bubble removal apparatus for removing a bubble on a substrate during a process of manufacturing a display panel or a semiconductor using a liquid, and more particularly, to a bubble removal apparatus using acoustic waves that collects a bubble on a substrate using an acoustic wave and removes the bubble by moving the bubble to a desired position, and a bubble removal method using the same.

Bubble removal apparatus comprising an acoustic wave generator that forms a standing acoustic field by generating a pair of acoustic waves and bubble removal method using the same

Provided are an apparatus and a method of controlling a stiffness of a soft material hardened from a liquid state having viscosity into a solid state. The apparatus of controlling a stiffness of a soft material includes: a soft material accommodating means including a chamber corresponding to a space in which the soft material having fluidity before being hardened is accommodated and a wall structure surrounding the chamber; and a stimulus means applying a stimulus to the soft material to generate a flow in the soft material, wherein a flow is applied to the soft material to control the stiffness in the soft material and control stiffnesses to be different from each other in each region of the soft material.

Apparatus and method of controlling stiffness of soft material

A solar cell module and a method of manufacturing the same are provided. The method of manufacturing a solar cell module includes forming a plurality of strings to which a plurality of solar cells are connected; disposing a target string at a repair device, the target string including a target solar cell having a defect; separating the target solar cell from the target string by selectively thermally processing a connection area of a target intercell connector and the plurality of conductive wirings fixed to the target solar cell; disposing a new solar cell at the target string; and connecting the plurality of conductive wirings fixed to the new solar cell to the target intercell connector.

Method for manufacturing solar cell module having defect tested solar cell strings

A solar cell module includes a plurality of cell strings having a plurality of solar cells, each solar cell having a semiconductor substrate, and a first conductivity-type electrode and a second conductivity-type electrode provided on a first surface of the semiconductor substrate, an interconnector electrically connecting a first conductivity-type electrode of a first solar cell, among the plurality of solar cells included in the plurality of cell strings, and a second conductivity-type electrode of a second solar cell adjacent to the first solar cell in a first direction, to connect the first and second solar cells in series, and a first shield positioned on a front surface of the interconnector between the first and second solar cells, and extending in a second direction crossing the first direction.

Growing community of inventors

Seoul, South Korea

Byungjun Kang