Stats Chippac Pte. Ltd.

ByungHyun Kwak

HeeSoo Lee

Hun Teak Lee

MinJung Kim

Seong Won Park

GwangTae Kim

ChangHwan Kim

WoonJae Beak

A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

Integrated circuit packaging system with plated copper posts and method of manufacture thereof

Growing community of inventors

Icheon-si, South Korea

ByungHyun Kwak