Samsung Electronics Co., Ltd.

Seoul National University

Sungkyunkwan University

Industry-University Cooperation Foundation Hanyang University

Fine Semitech Corp.

Byunghoon Lee

Changyoung Jeong

Hyungwoo Lee

Changjoon Lee

Junghwan Moon

Maenghyo Cho

Jamyeong Koo

Muyoung Kim

Min Cheol Park

Sungwoo Park

Kyungwoon Jang

Byunggook Kim

Changkyu Chung

Sungyong Min

Jungmin Park

Jungchul An

Chihyun Cho

Chulwoo Park

Tae-Gon Kim

Jeonggyu Jo

Sanguk Park

Minki Kim

Byungchul Yoo

Yongjae Song

Hyuntae Jang

Jinho Ahn

Sungtae Park

Jeonggen Yoon

Hoojeong Lee

Juseung Lee

Taeil Kim

Youngkyong Jo

Myungjun Kim

Jeonghwan Min

Kyoungchae Seo

Woosung Jang

Jikang Kim

Joonmyung Choi

Hongshin Shin

Jin Goo Park

Hyun-tae Kim

An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.

Method of removing an adhesive for an EUV mask and method of reusing an EUV mask

Various embodiments of the disclosure disclose a method for manufacturing a micro Light Emitting Diode (LED) display. The disclosed manufacturing method may include coating a face of a substrate including a circuit portion with a first thickness of a polymer adhesive solution containing a plurality of metal particles, attaching an array of micro LED chips on the polymer adhesive solution, physically connecting a connection pad for each of the array of micro LED chips to the metal particles through heating and pressing the attached plurality of micro LED chips to descend through the polymer adhesive solution, and chemically bonding the metal particles to the connection pad and the circuit portion through heating and pressing so that the micro LED chips are electrically connected to the circuit portion. Various other embodiments are also possible.

Micro LED display and manufacturing method therefor

There are provided a lithography method capable of selecting best resist and a semiconductor device manufacturing method and exposure equipment based on the lithography method. The lithography method includes estimating a shape of a virtual resist pattern based on a multi-scale simulation for resist, forming a test resist pattern by performing exposure on selected resist based on the simulation result, comparing the test resist pattern with the virtual resist pattern, and forming a resist pattern on an object to be patterned by using the resist when an error between the test resist pattern and the virtual resist pattern is in an allowable range.

Lithography method using multi-scale simulation, semiconductor device manufacturing method and exposure equipment

A pellicle cleaning apparatus includes a stage to support a pellicle, a particle remover above the stage, the particle remover being configured to remove a particle from a first surface of a pellicle, and the particle remover including a cantilever, and an adhesive material on a bottom surface of the cantilever, and a pressure controller adjacent to the stage, the pressure controller being configured to control a pressure of a fluid on a second surface of the pellicle.

Pellicle cleaning apparatus and pellicle cleaning method using the same

An electronic device including a bonding layer in contact with an active area of a digitizer may include: the digitizer, a main magnet attached to a surface of the digitizer, a flexible printed circuit board electrically connected to the digitizer, and a bonding layer connecting the digitizer and the flexible printed circuit board, wherein the flexible printed circuit board includes a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and extension parts extending toward the main magnet from the base part.

Electronic device comprising bonding layer in contact with active area of digitizer

A lithography method using a multiscale simulation includes estimating a shape of a virtual resist pattern for a selected resist based on a multiscale simulation; forming a test resist pattern by performing an exposure process on a layer formed of the selected resist; determining whether an error range between the test resist pattern and the virtual resist pattern is in an allowable range; and forming a resist pattern on a patterning object using the selected resist when the error range is in the allowable range. The multiscale simulation may use molecular scale simulation, quantum scale simulation, and a continuum scale simulation, and may model a unit lattice cell of the resist by mixing polymer chains, a photo-acid generator (PAG), and a quencher.

Lithography method using multiscale simulation, and method of manufacturing semiconductor device and exposure equipment based on the lithography method

A micro-LED mounting structure includes a first layer having a conductive pad disposed on a surface thereof, a second layer including a first surface, a second surface opposite the first surface and disposed on the surface of the first layer, and a via-hole extending from the conductive pad of the first layer to the first surface and including a conductive material, and a micro-LED disposed on the first surface of the second layer to be electrically connected with the conductive material included in the via-hole. The via-hole includes a first opening in the first surface of the second layer and in which the conductive material is formed, the conductive material of the first surface provides a conductive area on a portion of the first surface of the second layer, and the conductive area and an area within a specified area of the conductive area define a substantially flat surface.

Mounting structure for mounting micro LED

A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

Micro LED display and manufacturing method with conductive film

A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.

Micro LED display module with excellent color tone and high brightness

Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

Transfer apparatus of an electronic component

An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.

Electronic device including flexible printed circuit board

Provided herein is a bump including a diffusion barrier bi-layer, the bump having: a conductive layer; a first diffusion barrier layer formed on or above the conductive layer, and comprising an alloy of nickel and phosphorus; a second diffusion barrier formed on or above the first diffusion barrier layer, and comprising copper; and a solder layer formed on or above the second diffusion barrier layer. A manufacturing method for producing a bump is also provided.

Bump including diffusion barrier bi-layer and manufacturing method thereof

Growing community of inventors

Suwon-si, South Korea

Byunghoon Lee