Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Samsung Electron Devices Co., Ltd.

Byunghee Kim

Naein Lee

Jongmin Baek

Sanghoon Ahn

Wookyung You

Vietha Nguyen

Hoyoung Kim

Kyeongdong Kim

Jiwon Kang

Kyu-Hee Han

Seunggyu Kang

Jaehun Lee

Byung-Kwon Cho

Hak-Sun Lee

Thomas Oszinda

YoungWoo Cho

Haesuk Choi

Songyi Han

Jiwon Yun

Taejin Yim

Young-ju Park

Sangshin Jang

Inoue Naoya

Byung-Lyul Park

Jiyoung Kim

Jonggil Pyo

Woojin Lee

Chulki Kim

Jaeyong Kim

Sang Hoon Ahn

Kyuhee Han

Hyunbae Lee

Kyoung-Hee Kim

Youngwook Kang

Jaeuk Ryu

Kyungmin Jeong

Deokyoung Jung

Doo-Sung Yun

Kangyeung Lee

Hanseok Hwangbo

Seungyong Yoo

Keeyoung Jun

Sangdon Nam

Hoyun Jeon

Kidae Park

A display device of the present disclosure comprises: a head including a display panel; a stand for supporting the head; and a pivot assembly, which is coupled to the head and the stand and rotates the head, wherein the pivot assembly comprises: a rotary ring fixed to the head; a cam ring or middle ring coupled to the rotary ring; a center plate, which is located between the rotary ring and the cam ring or the middle ring and rotates together with the rotary ring and the cam ring or the middle ring; and a rear plate pivot-connected to the center plate.

Display device

Disclosed is a display device. The display device includes: a flexible display panel; a flexible platewhich is located in a rear side of the display panel, and coupled to the display panel; a backbone linkwhich is coupled to a rear side of the plate, and is joint-connected to a plurality of links; a driving unitwhich is located in one side of the backbone link, and has a motor; a driving linkwhich is coupled to the other side of the backbone link; and a lead screwwhich extends long in a length direction of the backbone link, has one end connected to the motor, and has the other end connected to the driving link, wherein when the lead screwrotates, the driving linkseparates the other side of the backbone linkfrom the lead screwwhile standing up.

A display device is disclosed. The display device includes a display panel configured to be wound around or unwound from a roller installed in a housing, wherein the housing is configured to provide a receiving space for the display panel, a module cover coupled to a rear of the display panel, wherein the module cover is configured to be wound around or unwound from the roller with the display panel, an extension sheet extending from a lower side of the display panel, wherein the extension sheet is configured to be wound from the roller, and at least one shock-absorbing member positioned next to a lower end of the module cover, wherein the at least one shock-absorbing member is disposed at a rear surface of the extension sheet.

A display apparatus includes a base, a stand vertically extending upward from the base, a head having a display provided on a front surface thereof and pivotable between a landscape mode and a portrait mode, a penetration groove extending along the circumference of the head, a connecting bar connected to the stand and extending to an inside of the head through the penetration groove, an inner plate fixed to the inside of the head, a first guide groove formed in the inner plate and extending along a predetermined curved trajectory, a first guide pin protruding from the connecting bar and inserted into the first guide groove, a second guide groove formed in the connecting bar and extending in a longitudinal direction of the connecting bar, and a second guide pin fixed to the inside of the head or protruding from the inner plate and inserted into the second guide groove.

Display apparatus

A display device includes: a housing; a roller rotatably disposed on the housing; a flexible display that is rolled around the roller or unrolled from the roller; a first arm connected to the flexible display; an arm supporter provided in the housing; an arm shaft rotatably supported to the arm supporter; a second arm coupled to the arm shaft and rotated together with the arm shaft to rotate the first arm; a rotation mechanism connected to the second arm to rotate the second arm about the arm shaft; and an angle sensor module connected to at least one of the arm shaft and the second arm.

A display device includes a housing in which an opening is formed, a roller rotatably disposed in the housing, a display module rolled around the roller or unrolled from the roller, a lift module connected to the display module and lifting the display module through the opening, a door disposed in the housing and opening and closing the opening, and a door driving module disposed in the housing and connected to the door to move the door to a closed position, a partially open position, or a maximum open position.

A semiconductor device is provided. The semiconductor device includes first metal lines on a lower layer, a dielectric barrier layer provided on the lower layer to cover side and top surfaces of the first metal lines, an etch stop layer provided on the dielectric barrier layer to define gap regions between the first metal lines, an upper insulating layer on the etch stop layer, and a conductive via penetrating the upper insulating layer, the etch stop layer, and the dielectric barrier layer to contact a top surface of a first metal line. The etch stop layer includes first portions on the first metal lines and second portions between the first metal lines. The second portions of the etch stop layer are higher than the first portions.

Semiconductor device and method of fabricating the same

A method of manufacturing the semiconductor device includes providing a first interlayer dielectric layer having a conductive pattern, sequentially forming a first etch stop layer, a second etch stop layer, a second interlayer dielectric layer and a mask pattern on the first interlayer dielectric layer, forming an opening in the second interlayer dielectric layer using the mask pattern as a mask, the opening exposing the second etch stop layer, and performing an etching process including simultaneously removing the mask pattern and the second etch stop layer exposed by the opening to expose the first etch stop layer.

Method of manufacturing semiconductor device using a plurality of etch stop layers

A semiconductor device includes an interlayer insulating layer including a first insulating layer on a substrate, and a plurality of interconnections in the first insulating layer. The interlayer insulating layer includes a first region, and a second region including an air gap. The air gap is defined between a pair of the interconnections in the second region. A top surface of the first insulating layer of the first region is lower than a top surface of at least one of the interconnections in the first region.

Planarized interlayer dielectric with air gap isolation

A semiconductor device comprises a lower structure on a substrate and including a recess region, first and second barrier layers covering an inner surface of the recess region and a top surface of the lower structure, the inner surface of the recess region including a bottom surface and an inner sidewall connecting the bottom surface to the top surface of the lower structure, and an interlayer dielectric layer provided on the second barrier layer and defining an air gap in the recess region. A first step coverage is obtained by dividing a thickness of the first barrier layer on an inner sidewall of the recess region by a thickness of the first barrier layer on the top surface of the lower structure. A second step coverage is obtained by dividing a thickness of the second barrier layer on the inner sidewall of the recess region by a thickness of the second barrier layer on the top surface of the lower structure. The first step coverage is different from the second step coverage.

Semiconductor device including air-gap

A semiconductor device may include a substrate, a first interlayered insulating layer on the substrate having openings, conductive patterns provided in the openings, first to fourth insulating patterns stacked on the substrate provided with the conductive patterns, and a second interlayered insulating layer provided on the fourth insulating pattern.

Semiconductor devices

A method of treating a porous dielectric layer includes preparing a substrate on which the porous dielectric layer including an opening and pores exposed by the opening is formed, supplying a first precursor onto the substrate to form a first sub-sealing layer sealing the exposed pores, and supplying a second precursor onto the first sub-sealing layer to form a second sub-sealing layer covering the first sub-sealing layer. Each of the first and second precursors includes silicon, and a molecular weight of the second precursor is smaller than that of the first precursor.

Method of treating a porous dielectric layer and a method of fabricating a semiconductor device using the same

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Seoul, South Korea

Byunghee Kim