Hyundai Motor Company

Kia Motors Corporation

Skhynix Inc.

Seagate Technology Incorporated

Intron Biotechnology, Inc.

Samsung Electronics Co., Ltd.

Yonsei University

Lg Electronics Inc.

Kia Corporation

Seoul National University

Seagate Technology International

Industry-Academic Cooperation Foundation

Hee Sung Metal Ltd.

Byung Wook Kim

Jin Woo Kwak

In Woong Lyo

Kyong Hwa Song

Han Saem Lee

Hoo Dam Lee

Gyung Bok Kim

Yong Hwan Hong

SAng Hyeon Kang

Seong Jun Yoon

Soo Youn Jun

Jee Soo Son

Hyoun Rok Paik

Woo Ju Lee

Woo Young Lee

Min Jae Lee

In Su Lee

Hee Jeong Shin

Gwan Sik Kim

Seung Woo Lee

Jung Min Lee

Hong Kil Baek

Jong Kook Lee

Su Jung Noh

Kwang Min Choi

Ho Chan An

Jong Ho Seon

Young Mi Ha

Young Min Ku

Jae Mu Ha

Keun Heo

Jeffrey Kwak

Jae Myung Pi

Gil Young Noh

Kang Soo Seo

Jea Yong Yoo

Hyung Sun Kim

Young Sun Kim

Soung Hyun Um

Moo Young Kim

Dong Wook Lee

Yoon Jin Kim

Seung Hwan Ko

Dae Il Choi

In Chang Chu

Rae Jin Uh

Suk Hwang Park

Ji Yong Kim

Woo Chul Kim

Hee Deog Kim

Jinhyeok Cha

Sang Su Ha

Dong Min Kang

Dong-ho Choi

Kyung Wook Choi

Ju Beam Lee

Jinwoo Kwak

O Deuk Kwon

Byung Jin Hwang

Jae Soung Park

Hak Ryoul Kim

Hwi Jong Lee

Jin Woo Lee

A-Young Kim

Byeong Hoon Yeon

Sang Gwon Hwang

Seong Won Jeong

Chea Jung Lim

Kyoung Hyun Son

Dae Keun Ryoo

Seung Ho Yang

Yeong Ju Jung

Gyungbok Kim

Jin Goo Lee

Jong Bae Kim

Dong Keon Lee

Sung Mee Cho

Na Kyong Yun

Hyun Jun Rim

A semiconductor package capable of reducing or preventing cracks from occurring in a conductive bump and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a first conductive bump; a first re-distribution layer which is provided between the semiconductor chip and the first conductive bump and electrically connects the semiconductor chip and the first conductive bump; and a buffer structure which formed to fill up a space between a side surface of the first conductive bump and one surface of the first re-distribution layer, in which the buffer structure includes a plurality of pores.

Semiconductor package and manufacturing method thereof

In an embodiment a method for preparing a laminate includes forming a cured film by coating a source material composition including a polymer for a base layer and an inorganic particle for forming a pore, obtaining a porous base layer having a spherical pore derived from the inorganic particle by removing the inorganic particle from the cured film through an etching process and forming a coating layer, which has a repeated pattern, on a surface of the porous base layer.

Laminate for radiational cooling, and method for preparing the same

A thermoelectric module includes: an electrode; a double layer stacked on a thermoelectric pellet; and a solder layer interposed between the double layer and the electrode to bond the double layer to the electrode, the solder layer containing a Sn&#x2014;Cu-based alloy. The solder layer is formed to have an interface with one of the double layer and the electrode and has at least one &#x3b5; layer having an &#x3b5; phase (CuSn).

Thermoelectric module and method for manufacturing the same

A thermoelectric module includes an N-type thermoelectric material and a P-type thermoelectric material disposed so as to be spaced apart from the N-type thermoelectric material. A flexible electrode is electrically connected to the N-type thermoelectric material and the P-type thermoelectric material. The flexible electrode is configured to bend to match a curvature of an object, e.g., a steering wheel of a vehicle.

Thermoelectric module and manufacturing method thereof

A thermoelectric module includes a flexible film with an insulation characteristic, the film having a shape that is longer in a lengthwise direction than in a width direction, a plurality of n-type thermoelectric elements and a plurality of p-type thermoelectric elements alternately arranged on one surface of the film in the lengthwise direction of the film, and first electrodes and second electrodes that alternately connect the plurality of n-type thermoelectric elements and the plurality of p-type thermoelectric elements at one side and an opposite side with respect to the width direction of the film to electrically connect the plurality of n-type thermoelectric elements and the plurality of p-type thermoelectric elements in series. One lateral end and an opposite lateral end of the film are bent with the plurality of n-type thermoelectric elements, the plurality of p-type thermoelectric elements, the first electrodes, and the second electrodes attached to the film.

Thermoelectric module and temperature modulating apparatus including the same

A thermoelectric module includes: unit thermoelectric materials including N-type thermoelectric materials and P-type thermoelectric materials and arranged on one surface of a first substrate; first electrodes each electrically connected to one end of a respective one of the N-type thermoelectric materials or to one end of a respective one of the P-type thermoelectric materials; second electrodes each disposed to be spaced apart from the other end of the respective one of the N-type thermoelectric materials and the other end of the respective one of the P-type thermoelectric materials by a predetermined gap; and a second substrate supporting the second electrodes, in which each of the second electrodes is electrically connected to the second end of the respective one of the N-type thermoelectric materials and the second end of the respective one of the P-type thermoelectric materials when a pressing force is applied to the second substrate.

Thermoelectric module

A thermoelectric module includes a first thermoelectric material, a second thermoelectric material spaced apart from the first thermoelectric material, and a stretching element selectively connected between the first thermoelectric material and the second thermoelectric material, wherein the stretching element is stretchable.

A thermoelectric generator for a vehicle utilizing heat of exhaust gas discharged from an engine of the vehicle includes a heat exchange unit, through which a coolant circulates, a thermoelectric generation unit for converting thermal energy of exhaust gas into electrical energy, a first flow passage for guiding the exhaust gas to pass through the heat exchange unit, a second flow passage for guiding the exhaust gas to pass through the thermoelectric generation unit, a third flow passage for guiding the exhaust gas to bypass the heat exchange unit and the thermoelectric generation unit without passing therethrough, a first valve for opening or closing the first flow passage, a second valve for selectively opening or closing the second flow passage and the third flow passage, and a driving unit for operating the first valve and the second valve by a single power source.

Thermoelectric generator for vehicle

A thermoelectric material includes a lower part from a bottom surface of the thermoelectric material to a point of 30% of an average thickness of the thermoelectric material and having an average content of carbon atoms of 40 at% or more in the thermoelectric material, and an upper part corresponding to a remaining 70% of the average thickness of the thermoelectric material and having an average content of carbon atoms of 20 at% or less in the thermoelectric material.

Thermoelectric material and thermoelectric module comprising the same

A thermoelectric module mounted on an uneven surface (a curved surface or an irregular surface) to reduce thermal boundary resistance and significantly improve thermoelectric power generation efficiency is provided. The thermoelectric module includes one or more first thermoelectric elements, one or more second thermoelectric elements having opposite polarity to that of the first thermoelectric elements and alternating with the first thermoelectric element. An electrode unit in provided and includes upper and lower electrodes configured to electrically connect the first and second thermoelectric elements. A connection member is configured to connect the first and second thermoelectric elements to vary the relative positions of the first and second thermoelectric elements.

A thermoelectric conversion module may include a plurality of n-type thermoelectric conversion elements and a plurality of p-type thermoelectric conversion elements alternating with one another, a plurality of first electrodes and a plurality of second electrodes that alternately connect the plurality of alternating n-type and p-type thermoelectric conversion elements at hot sides and cool sides, and a plurality of case electrodes, each of which selectively connects the first electrodes adjacent to each other, among the plurality of first electrodes. The first electrodes and the case electrodes are configured to be movable relative to each other so that the plurality of first electrodes are electrically connected through the plurality of case electrodes or electrical connections between the plurality of first electrodes through the plurality of case electrodes are disabled according to a relative movement of the plurality of first electrodes and the plurality of case electrodes.

Thermoelectric conversion module and thermoelectric conversion module system

A thermoelectric element unit is provided. The thermoelectric element unit includes a plurality of thermoelectric elements and a plurality of electrodes embedded in each of the thermoelectric elements by a predetermined number. Additionally, at least one of the plurality of electrodes includes a terminal part that protrudes to an exterior of the thermoelectric element having the at least one electrode embedded among the thermoelectric elements.

Thermoelectric element unit, thermoelectric module including the same, and method for manufacturing the same

The present disclosure relates to a thermoelectric module sheet that includes a base substrate, a plurality of thermoelectric elements laminated on a surface of the base substrate, and a plurality of electrodes, each of which is laminated on at least one surface of at least one of the plurality of thermoelectric elements to electrically connect the plurality of thermoelectric elements by a predetermined connecting method.

Thermoelectric module sheet and thermoelectric module assembly including the same

An electronic device is disclosed. The disclosed electronic device includes a display, a charging circuit that transmits and receives power to and from an external electronic device, a sensor circuit that senses a spatial relationship of the electronic device with the external electronic device, a processor that is electrically connected with the display, the charging circuit, and the sensor circuit. When wirelessly transmitting or receiving power to or from the external electronic device using the charging circuit, the processor may transmit and receive information associated with the wireless transmission or reception of power and display the information based on the spatial relationship.

Device for performing wireless charging and method thereof

A heat exchanger for a vehicle is provided to improve fuel efficiency by implementing an integrated structure of exhaust gas heat recovery function and thermoelectric generation function. The heat exchanger allows exhaust gas that is flowed into the heat exchange generator in the cold start mode of the vehicle to pass through the exhaust gas heat recovery component side and thermoelectric generation component side. Therefore, the temperature of the coolant rapidly increases, thereby reducing the engine warm-up time, and electricity is generated through thermoelectric module, thereby maximizing the fuel efficiency improvement.

Heat exchanger for vehicle

Growing community of inventors

Seongnam-si, South Korea

Byung Wook Kim