Samsung Electronics Co., Ltd.

Byung-Woo Woo

Woo-Sik Kim

Choul-Su Kim

Masaharu Sukue

Masaharu Tsukue

Sung-Beom Sim

Sang-Beom Sim

An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.

Method for mounting integrated circuits on printed circuit boards

A method for mounting an integrated circuit having a plurality of leads on a PCB. In order to mount the integrated circuit having a plurality of leads on the PCB, foreign substance on the PCB is first removed and a flux is simultaneously spread over the lead patterns formed on the PCB. After that, by aligning the leads of the integrated circuit with lead patterns on the PCB on which the flux is spread, some leads of the integrated circuit is temporarily fixed to the corresponding lead patterns of the PCB. After soldering the leads of the integrated circuit to the lead patterns of the PCB by radiating an optical beam on the entire whole surface, the soldered PCB is cooled, thereby mounting the integrated circuit on the PCB.

Method for mounting an integrated circuit from a tape carrier package on

A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the lead patterns on the PCB on which the flux is spread; soldering the leads and lead patterns by covering the part of a semiconductor chip of the aligned integrated circuit using a holding block and radiating an optical beam onto the whole surface thereof; and cooling the holding block and PCB which has been soldered, which prevents shorts and a poor contact generated by an earlier method. As the quality of soldering is enhanced and the lead is not pressured when soldering, the confidence of the integrated circuit after mounting is also enhanced. Moreover, by soldering all of the leads at one time, the operational time can be reduced.

Growing community of inventors

Suwon, South Korea

Byung-Woo Woo