Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Dongjin Semichem Co., Ltd.

Lg Display Co., Ltd.

Lg Philips Lcd Co., Inc.

Korea University Research and Business Foundation

Byung-Uk Kim

Hoon Jong Kang

Sang-Hoon Lee

Hyoc-Min Youn

Hong-Sick Park

Hi-Kuk Lee

Wy-Yong Kim

Jeong-Min Park

Bong-Kyun Kim

Sang-Dai Lee

Ji-Hyun Kim

Gee-Sung Chae

Jong-Hyun Choung

Jun Su Chun

Jin Ho Ju

Jin-Wuk Kim

Oh-Nam Kwon

Soon-Sung Yoo

Jae-Sung Kim

Dong-Ki Lee

Kyoung-Mook Lee

Sun-Young Hong

Byung-Geol Kim

Yong-Sup Hwang

Ki-Hyun Cho

Sung-Hee Kim

Sung-Kyun Park

Byong-Hoo Kim

Chang-Il Oh

Hyang-Shik Kong

Jin-Ho Ju

Dong-Min Kim

Yang-Ho Jung

Hyun-Woo Kim

Shin-Il Choi

Byeong-Jin Lee

Jong-Min Kim

Koichi Sugitani

Jung-In Park

Jung-Soo Lee

Seung Bo Shim

Jeong Won Kim

Woo-Seok Jeon

Sang-Hyun Yun

Jun Hyuk Woo

Young-Joo Choi

Jun Gi Kim

Wang-Woo Lee

Kwang Woo Park

Suk-Il Yoon

Jong-Hyun Jeong

Soon-Beom Huh

Ki-Beom Lee

Seong-Bae Kim

Ki-Hyuk Koo

Jin-Sun Kim

Myoung-Soo Lee

Cyoo-Chul Jo

Mi-Sun Park

Sung-Gun Shin

Se-Hwan Jung

Doo-Young Jang

Tai-Hoon Yeo

Jong-Soon Yoo

Joo-Pyo Yun

Seung-Hyup Shin

Sun-Joo Park

Chong-Soon Yoo

Nam-Seok Suh

Yeong-Beom Lee

Jin-Young Choi

Chun-Hyuk Lee

Ji-Hum Baik

Jun-Yong Song

Seung-Ki Kim

Tae-Hoon Yeo

Won-Lae Kim

Hong Choi

Soon-Beom Hur

Byeoung-Jin Lee

Oh-Hwan Kweon

Jun-Youg Song

Yong-Woo Kim

Jin-Sup Hong

Sang-Gak Choi

Dong-Myung Kim

Seung-uk Lee

Woo-sik Jun

Dae-youn Park

Ju-hyuk Kim

Hyo-jin Yun

Sung-gun Shin

Hyo-sun Lee

Suk-il Yoon

Oh-hwan Kweon

Ja-Hun Byeon

Mun-Pyo Hong

Byung-Seong Bae

Seok-Jun Jang

A photoresist composition includes about 0.1 to about 30 parts by weight of a photo-initiator, about 1 to 50 parts by weight of a first acrylate monomer including at least five functional groups, about 1 to 50 parts by weight of a second acrylate monomer including at most four functional groups with respect to about 100 parts by weight of an acryl-copolymer.

Photoresist composition and method of manufacturing a thin film transistor substrate

A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKvalue of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.

Photoresist composition

A photosensitive resin composition is disclosed. The disclosed photosensitive resin composition includes an acryl-based copolymer formed by copolymerizing i) unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, or a mixture thereof, and ii) an olefin-based unsaturated compound or a mixture thereof, a dissolution inhibitor in which a phenolic hydroxyl group is protected by an acid-degradable acetal or ketal group, a photoacid generator, and a solvent.

Photosensitive resin composition, method of forming pattern, and liquid crystal display using the same

A photosensitive resin composition includes: an acrylic copolymer comprising a polymerization product of a first monomer comprising at least one selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a second monomer comprising an olefin-based unsaturated compound; a photosensitive component comprising at least one 1,2-quinonediazide-5-sulfonic acid ester compound selected from compounds represented by Chemical Formulae 1 to 4; a coupling agent; and a solvent, wherein a total amount of asymmetric compounds in the photosensitive component is greater than or equal to 45 area percent as determined by high performance liquid chromatography: 

Photosensitive resin composition and method of forming pattern using the same

Disclosed are an ink composition for an imprint lithography and a roll printing, wherein in forming patterns of the LCD device using the imprint lithography and the roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, and wherein the ink composition is endurable even at a high temperature of 90-250&#xb0; C.

Ink composition for imprint lithography and roll printing

A thinner composition for a reduced resist coating process includes an alkyl lactate, cyclohexanone, and an alkyl acetate, wherein an alkyl substituent of the alkyl acetate is a C1 to C5 non-ether based alkyl group.

Thinner composition for RRC process, apparatus for supplying the same, and thinner composition for EBR process

The present invention relates to a photoresist composition for digital exposure and a method of fabricating a thin film transistor substrate. The photoresist composition for digital exposure includes a binder resin including a novolak resin and a compound represented by the chemical formula (1), a photosensitizer including a diazide-based compound, and a solvent: 

Photoresist composition and method of fabricating thin film transistor substrate

The present invention relates to an electric-field drive display device. According to one embodiment of the present invention, the electric-field drive display device comprises: a first substrate; a first electrode which is formed on the first substrate; a second electrode which is formed on the first substrate and is disposed in parallel with the first electrode; a drive partition wall which is formed on the first electrode and the second electrode and has a plurality of opening and closing holes; and a plurality of drive bodies which are disposed inside each of the opening and closing holes. Consequently, the electric-field drive display device according to one embodiment of the present invention can adjust the amount of light transmitted and so display the desired image by adjusting the positions of the drive bodies in the horizontal direction through the use of electrical force.

Display device driven by electric field

A composition for removing a photoresist, the composition including about 1% by weight to about 10% by weight of tetramethyl ammonium hydroxide ('TMAH'), about 1% by weight to about 10% by weight of an alkanol amine, about 50% by weight to about 70% by weight of a glycol ether compound, about 0.01% by weight to about 1% by weight of a triazole compound, about 20% by weight to about 40% by weight of a polar solvent, and water, each based on a total weight of the composition.

Composition for removing a photoresist and method of manufacturing a thin-film transistor substrate using the composition

A method of fabricating a thin film transistor substrate and a negative photoresist composition used therein are provided, which can reduce pattern inferiority. The method of fabricating a thin film transistor substrate includes forming a conductive film composed of a conductive material on a substrate, forming an etch pattern composed of a negative photoresist composition on the conductive film, and forming a conductive pattern by etching the conductive film using the etch pattern as an etching mask, wherein the negative photoresist composition includes 10-50 parts by weight of novolak resin including a hydroxyl group that is soluble in an alkali developing solution, 0.5-10 parts by weight of a first photo acid generator represented by the following formula (1), 0.5-10 parts by weight of a second photo acid generator represented by the following formula (2), 1-20 parts by weight of a cross-linking agent, and 10-90 parts by weight of a solvent: 

Method of fabricating thin film transistor substrate and negative photoresist composition used therein

A composition for removing a photoresist includes a) an amine compound having a cyclic amine and/or a diamine, b) a glycol ether compound, c) a corrosion inhibitor and d) a polar solvent. The composition further includes a stripping promoter. Further disclosed is a method of manufacturing an array substrate using the composition for removing a photoresist.

Composition for removing photoresist and method of manufacturing an array substrate using the same

The present invention provides a photoresist stripper including about 5 wt % to about 20 wt % alcohol amine, about 40 wt % to about 70 wt % glycol ether, about 20 wt % to about 40 wt % N-methyl pyrrolidone, and about 0.2 wt % to about 6 wt % chelating agent.

Composition for stripping photoresist and method for manufacturing thin transistor array panel using the same

A composition for a photoresist stripper and a method of fabricating a thin film transistor array substrate are provided according to one or more embodiments. In one or more embodiments, the composition includes about 5-30 weight % of a chain amine compound, about 0.5-10 weight % of a cyclic amine compound, about 10-80 weight % of a glycol ether compound, about 5-30 weight % of distilled water, and about 0.1-5 weight % of a corrosion inhibitor.

Composition for photoresist stripper and method of fabricating thin film transistor array substrate

Disclosed are an ink composition and a method for fabricating a liquid crystal display (LCD) device using the same, wherein in forming patterns of the LCD device using an imprint lithography and a roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, the ink composition consisting of 5-45% by weight of polymer resin, 5-45% by weight of additive added to retain thermal stability, and 50-90% by weight of organic solvent, wherein the ink composition is endurable even at a high temperature of 90-250&#xb0; C.

Ink composition and method of fabricating liquid crystal display device using the same

Disclosed herein is a resin composition for an organic insulating layer, a method of manufacturing the same, and a display panel including an insulating layer formed using the resin composition. The resin composition for an organic insulating layer is produced by polymerizing about 5 to about 35 wt % of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture of the unsaturated carboxylic acid and the unsaturated carboxylic acid anhydride, about 5 to about 40 wt % of a styrene compound, about 5 to about 40 wt % of an epoxy compound, about 0.1 to about 10 wt % of an isobornyl compound, and about 20 to about 40 wt % of a dicyclopentadiene compound, based on the total weight of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, styrene compound, isobornyl compound, and dicyclopentadiene compound.

Resin composition for organic insulating layer, method of manufacturing resin composition, and display panel including resin composition

Growing community of inventors

Hwaseong-si, South Korea

Byung-Uk Kim