Samsung Electronics Co., Ltd.

Byung-Sup Rho

Sun-Tae Jung

Han-Seo Cho

Dong-Su Kim

Hyo-Hoon Park

Hyo-Hun Park

An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.

Optical connection block, optical module, and optical axis alignment method using the same

A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

Growing community of inventors

Daejeon, South Korea

Byung-Sup Rho