Lg Innotek Co., Ltd.

Byung Soo Ryu

Gun Kyo Lee

Disclosed herein is a semiconductor light emitting device module comprising: a substrate; at least one support disposed on a surface of the substrate; a heat transfer member disposed on the substrate and the support, the heating transfer member having a cavity formed in at least a portion of the heat transfer member; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer, the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member.

Growing community of inventors

Seoul, South Korea

Byung Soo Ryu