Samsung Electronics Co., Ltd.

Byung-sik Moon

Seong-Jin Jang

Kwang-Hyun Kim

Jong-Pil Son

Sang-Kyun Park

Won-Chang Jung

Ju-Seop Park

Jeong-Sik Nam

Jin-ho Kim

Nam-seog Kim

Uk-Song Kang

Kye-hyun Kyung

Hoon Bok Lee

Doo-young Kim

Dong-hyeon Jang

Woo-Dong Lee

Hyoung-Joo Kim

Ho-Sung Song

Dong-Hak Shin

Ki-Won Park

Byung-Hyun Lee

Hyuck-Chai Jung

Seung-Bum Ko

Seung-Hoon Oh

Kyo-min Sohn

Jung-Hwa Choi

A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked.

3D semiconductor device

A fuse circuit includes a program unit and a sensing unit. The program unit is programmed in response to a program signal and outputs a program output signal in response to a sensing enable signal. The sensing unit outputs a sensing output signal based on the program output signal and the sensing output signal indicates whether the program unit is programmed or not. The program unit includes an anti-fuse cell, a selection transistor, a program transistor and a sensing transistor. The anti-fuse cell includes at least two anti-fuse elements which are connected in parallel and are respectively broken down at different levels of a program voltage.

Fuse circuit, fuse array, semiconductor memory device and method of manufacturing semiconductor device

A fuse circuit includes a program unit, a sensing unit and a control unit. The program unit is programmed in response to a program signal, and outputs a program output signal in response to a sensing enable signal. The sensing unit includes a variable resistor unit that has a resistance that varies based on a control signal, and generates a sensing output signal based on the resistance of the variable resistor unit and the program output signal. The control unit generates the control signal having a value changed depending on operation modes, and performs a verification operation with respect to the program unit based on the sensing output signal to generate a verification result. The program unit may be re-programmed based on the verification result.

Fuse circuit and semiconductor memory device including the same

A memory cell includes a selection transistor on a substrate and an antifuse on the substrate. The selection transistor includes a first gate connected to a read word line, a first gate insulation layer that insulates the first gate from the substrate, a first source region connected to a bit line, and a first drain region, an impurity concentration of the first drain region being lower than an impurity concentration of the first source region. The antifuse includes a first electrode connected to a program word line and a second electrode connected to the selection transistor.

Memory cell, methods of manufacturing memory cell, and memory device having the same

Provided are an anti-fuse, an anti-fuse circuit, and a method of fabricating the anti-fuse. The anti-fuse includes a semiconductor substrate, an isolation region, a channel diffusion region, a gate oxide layer, and a gate electrode. The semiconductor substrate includes a top surface and a bottom portion, the bottom portion of the semiconductor substrate having a first conductivity type. The isolation region is disposed inward from the top surface of the semiconductor substrate to a first depth. The channel diffusion region is disposed inward from the top surface of the semiconductor substrate to a second depth, the second depth located at a depth where the channel diffusion region meets an upper boundary of the bottom portion of the semiconductor substrate. The channel diffusion region is surrounded by the isolation region, the first depth is a greater distance from the top surface of the semiconductor substrate than the second depth, and the channel diffusion region has a second conductivity type opposite to the first conductivity type. The gate oxide layer is disposed on the channel diffusion region, and the gate electrode is disposed on the gate oxide layer to cover a top surface of the gate oxide layer.

Anti-fuse, anti-fuse circuit including the same, and method of fabricating the anti-fuse

A semiconductor memory device including a data bus inversion (DBI) determination unit, a first inverter, a cyclic redundancy check (CRC) calculation unit, a second inverter, and a DQ pin. The DBI determination unit is configured to determine whether to perform DBI based on first data on a main data line and configured to generate DBI data. The first inverter is configured to invert or non-invert the first data according to the DBI data to generate second data. The CRC calculation unit is configured to generate CRC data based on the second data and the DBI data. The second inverter is configured to invert or non-invert the first data according to the DBI data to generate third data. The DQ pin is configured to output the third data externally.

Semiconductor memory device

Provided are a semiconductor device including a fuse and a method of operating the same. The semiconductor device includes a fuse array, a first register unit, and a second register unit. The fuse array includes a plurality of rows and columns. The first register unit receives at least one row of fuse data from the fuse array. Fuse data of the at least one row of fuse data is received in parallel by the first register unit. The second register unit receives the fuse data at least one bit at a time from the first register unit.

Semiconductor device including fuse array and method of operation the same

A semiconductor memory device includes a memory cell array having a plurality of memory cells coupled between a plurality of word lines and a plurality of bit line pairs, a bit line selection circuit configured to transmit data between a selected bit line pair and a local input/output line pair in response to a column selection signal, a local global input/output gate circuit configured to transmit data between the local input/output line pair and a global input/output line pair in response to a local global input/output selection signal, and a controller configured to drive the word lines, output the column selection signal having a first voltage level to the bit line selection circuit, and output the local global input/output selection signal having a second voltage level that is lower than the first voltage level to the local global input/output gate circuit, in response to an external address signal and an external command.

Semiconductor memory device capable of preventing damage to a bitline during a data masking operation

A semiconductor memory device includes first and second edge drivers configured to generate sensing control signals, a memory cell array between first and second edge drivers, and pluralities of unit sense amplifiers detecting data from the memory cell array in response to the sensing control signals.

Semiconductor memory device and data sensing method thereof

A redundancy program circuit and methods thereof. The redundancy program circuit may include a master fuse circuit with a master fuse outputting an operation enable signal to indicate a master fuse operating status, at least one control fuse circuit including at least one control fuse, the at least one control fuse circuit outputting an operating status signal for the at least one control fuse and a multiplexing unit configured to multiplex decoding address signal bits based on at least one of the operating status signal and the operation enable signal.

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Seoul, South Korea

Byung-sik Moon