Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Byung Seok Min

Jong Wook Park

Jae-Sung Park

Sung Hoon Kim

Jong Hwan Kim

Dong Jin Jeong

Ho Cheon Wey

Dong Hyun Kim

Do Won Heo

Beom Joon Kim

A display apparatus capable of correcting an image quality change caused by long-term use is provided. The display apparatus includes: a display panel; a communicator configured to communicate with a service apparatus; and a controller configured to control the communicator to transmit operation information including a total operating time of the display apparatus and an operating temperature of the display apparatus, to the service apparatus; receive an image parameter from the service apparatus through the communicator, and based on the received image parameter data; process image data; and transmit the processed image to the display panel. The image parameter may include at least one of a brightness level, a contrast, a sharpness level, and a color density of the display panel.

Display apparatus and control method thereof

A display apparatus includes: a display; a receiver configured to receive data of main content from a content provider; and a processor configured to control the receiver to receive image data and reference information about whether sub content is involved along with main content in the image data, control the display to display an image of the main content and the sub content selectively involved in the main content based on the image data received in the receiver, and make the image be displayed by one image process selected corresponding to whether the sub content is involved in the image based on the reference information among a plurality of image processes.

Display device, control method therefor and recording medium

There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.

Chip electronic component and manufacturing method thereof

Growing community of inventors

Suwon-si, South Korea

Byung Seok Min