Samsung Electro-mechanics Co., Ltd.

Byung Rok Ahn

Kyoung Jin Cha

Seon Jae Mun

Tae Gyeom Lee

Gi Long Kim

Jong Ho Lee

Woo Chul Shin

Beom Seock Oh

Tae Gyun Kwon

Eung Seok Lee

So Hyeon Hong

Jun Il Song

A method for manufacturing a multilayer ceramic capacitor including an operation of preparing a ceramic green sheet; an operation of forming a conductive paste on the ceramic green sheet; an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed; an operation of sintering the ceramic laminate; and an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.

Method for manufacturing a multilayer ceramic capacitor

There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.

Mutilayer electronic component and method of manufacturing the same

A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.

Multilayer electronic component and method of manufacturing the same

A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage.

Multilayered electronic component

Controlling an area fraction of a region of a capacitance formation portion of a multilayer electronic component may suppress occurrence of a short circuit between internal electrodes disposed inside a body of the multilayer electronic component, lower capacitance or reduced breakdown voltage. A range of brightness intensity of the region of the capacitance formation portion of the multilayer electronic component is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion disposed on the capacitance formation portion.

Multilayered electronic component and method of manufacturing the same

A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F+F)/D×100 is 35 or less, where Fis a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, Fis a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and Dis a size of the capacitance forming portion in the first direction at the center thereof in the second direction.

A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.

A capacitor component includes a body including a dielectric layer and an internal electrode, the internal electrode including nickel and an alloying element, and an external electrode disposed on the body to be connected to the internal electrode. The internal electrode includes an alloy region and an alloying element region.

Growing community of inventors

Suwon-si, South Korea

Byung Rok Ahn