Eo Technics Co., Ltd

Byung Oh Kim

Dong Jun Lee

Dong Won Hyun

The laser processing device includes: a measuring device configured to measure a change in a height of an object and including a first light source configured to emit probe light, a first light focusing unit configured to focus the probe light on the object, a light sensing unit configured to detect a change in the probe light reflected from a reflective surface of the object and including a Shack-Hartmann sensor, and a calculation unit configured to calculate the change in the height of the object by using the change in the reflected light detected by the light sensing unit; a second light source configured to emit laser light for processing to the object; and a focus adjusting device configured to adjust a focus of the laser light emitted to the object by using the change in the height of the object to be processed measured by the measuring device.

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Seoul, South Korea

Byung Oh Kim