Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Byung-Moon Kim

Je-Gwang Yoo

Han-Seo Cho

Suk-Hyeon Cho

Ho-Sik Park

Dong-Keun Lee

Sung-Jun Lee

A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.

Printed circuit board and manufacturing method thereof

A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Method of manufacturing component embedded printed circuit board

A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.

Component embedded printed circuit board

Growing community of inventors

Goyang-si, South Korea

Byung-Moon Kim