Samsung Display Co., Ltd.

Byung-moo Kim

Min Ho Bae

Yun Soo Kim

Sukju Kang

Geunyoung Yu

Tae-Ho Youn

A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.

Bonding device and method of bonding display device using the same

An electrostatic chuck and an electrostatic adsorption apparatus are provided. According to one or more exemplary embodiments, an electrostatic chuck includes: a main body portion including a body portion provided with a through-hole, and a transparent resin portion filled in the through-hole; a transparent cushion layer on the main body portion and covering the transparent resin portion; an electrode layer on the transparent cushion layer; and a dielectric layer on the electrode layer.

Growing community of inventors

Suwon-si, South Korea

Byung-moo Kim