Samsung Electronics Co., Ltd.

Byung-Man Kim

Dong-chun Lee

Chang-Yong Park

Dong-Woo Shin

Young-Soo Lee

Jong-Soo Choi

Kwang-Ho Chun

Kwang-Su Yu

Hyo-Jae Bang

Yong-Hyun Kim

Kwang-Seop Kim

Joung-Rhang Lee

Myung-Jong Eom

Se-Hyung Ryu

A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Semiconductor module with conductive element between chip packages

A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

Method and arrangement for attaching labels to semiconductor modules

In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Semiconductor module and method of forming a semiconductor module

A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.

Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board

An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.

Open socket

The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns.

Array printed circuit board

A semiconductor package is provided. In one embodiment, the semiconductor package includes a lead frame having a die pad and a plurality of leads disposed around the die pad. One or more semiconductor integrated circuit chips are mounted on the die pad and electrically connected to the plurality of leads. The semiconductor further includes a molding part for encapsulating the lead frame and the one or more chips. The molding part includes an upper molding portion having a first width, and a lower molding portion having a second width smaller than the first width to expose a portion of said leads from the lower molding portion. With the semiconductor package of the present invention, the mounting area and the mounting height on a substrate can be reduced. Also, the mounting reliability of a package on a substrate and electrical characteristics of the package can be improved.

Growing community of inventors

Cheonan-si, South Korea

Byung-Man Kim