Samsung Electro-mechanics Co., Ltd.

Byung-Kook Sun

Tae-Hoon Kim

Jee-Soo Mok

Jang-Kyu Kang

Seok-Kyu Lee

Keon-Yang Park

Jong-Kuk Hong

Jin-Yong Ahn

Geum-Hee Yun

Chang-Kyu Song

Kyung-Ro Yoon

Suk-Hyun Cho

Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Method of producing printed circuit board with embedded resistor

Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same

A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented from being electroplated with a metal. That is, a slot with an ink layer formed therein is formed in each of a plurality of boards. Then window regions of different sizes are defined, and a working is carried out on the portion where the slots are not formed. That is, the copper clad laminates are subjected to a working to form slots, and an ink layer is formed within each of the slots. In this manner, during the plating of the upper face of the printed circuit board, the metal is prevented from intruding into the window region, thereby preventing the formation of a short circuit.

Method for manufacturing printed circuit board

Growing community of inventors

Seoul, South Korea

Byung-Kook Sun