Samsung Electro-mechanics Co., Ltd.

Samsung Display Co., Ltd.

Byung Jun Jeon

Hyun Hee Gu

Kyu Ha Lee

Myung Jun Park

Chang Hoon Kim

Da Young Choi

Jae Young Park

Sang Hoon Kwon

Kyung Pyo Hong

Byoung Jin Chun

Jae Hwan Han

Chul Seung Lee

Woo Kyung Sung

Jin Soo Park

Jun Hyeong Kim

Eun Joo Choi

Seung Hee Yoo

Young Ghyu Ahn

Byoung Hwa Lee

Tae Yong Kim

Jeong Ryeol Kim

Hye Jin Lee

Yoo Jeong Lee

Ho In Jun

Eui Hyun Jo

Eun Sang Na

Hyung Jong Choi

Kwang Yeun Won

Chae Min Park

Hyung Duk Yun

So Jung An

Yong Won Seo

Hye Seong Kim

A Ra Cho

Kyoung No Lee

Jung Won Park

Gun Jung Yoon

Ha Jeong Kim

Byong Gyun Kim

Chang Joo Lee

Ki Hun Kim

Hyeon Suk Guak

Noh Joong Park

Yong-Hee Park

Young Il Jung

Ji Sook Kim

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces, a second external electrode including a 2-1-th electrode layer disposed on the fourth surface, and a 2-2-th electrode layer disposed on the first and second surfaces, wherein S>S, T≤8 μm, S>S, and T≤8 μm where based on a cross section of the first and second external electrodes, S, S, S, Sare fractions of an area occupied by glass in the 1-1-th, 1-2-th, 2-1-th, and 2-2-th electrode layers, respectively, Tand Tare thicknesses of the 1-2-th and 2-2-th electrode layers, respectively.

Multilayer electronic component

A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 μm×5 μm region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 μm or greater.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

A multi-optic vision device includes a dark-vision lighting apparatus illuminating a defect on a subject and leaving regions that surround the defect dark. A bright-vision lighting apparatus illuminates the subject and the regions that surround the defect and leaving the defect dark. A differential-vision lighting apparatus illuminates the subject so as to stereoscopically show the defect on the subject. An area scan camera continuously imaging the subject as the dark-vision lighting apparatus, the bright-vision lighting apparatus, and the differential-vision lighting apparatus simultaneously and respectively provide light. A controller processes the image to respectively obtain a dark-vision image, a bright-vision image, and a differential-vision image of the subject.

Multi-optic vision device utilizing area-scanning for detecting defects

A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.

Ceramic electronic component and method of manufacturing the same

There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te&#x2266;0.6 &#x3bc;m, N&#x3e;200, and 3 &#x3bc;m&#x2266;t&#x3c;L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.

Multilayer ceramic electronic component

There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.

Multilayered chip electronic component and board for mounting the same

There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.

Conductive paste composition for external electrode and multilayer ceramic electronic component including the same

There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by T, and a thickness of the ceramic body is denoted by T, T&#x2266;10 &#x3bc;m, T/T&#x3e;0.8, and t&#x2266;5 &#x3bc;m, so that a multilayer ceramic electronic component having excellent reliability may be realized.

There is provided a multi-layered ceramic electronic component including a ceramic body including a dielectric layer, first and second internal electrodes disposed within the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, wherein the first and second external electrodes include a conductive metal and glass and further include a second phase material occupying an area of 1 to 80% with respect to an area of glass in the first and second external electrodes.

Multi-layered ceramic electronic component

There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 &#x3bc;m or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 &#x3bc;m or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

Multilayer ceramic electronic component having external electrodes which include a metal layer and conductive resin layer

There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 &#x3bc;m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T, 0.8&#x2266;|T/Tc|&#x2266;1.0 is satisfied.

Multilayer ceramic electronic component and fabrication method thereof

A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 &#x3bc;m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T, 0.5&#x2266;|T/Tc|&#x2266;1.0 is satisfied.

There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.

Growing community of inventors

Gyunggi-do, South Korea

Byung Jun Jeon