Samsung Electronics Co., Ltd.

Byung-Joon Baek

Jaekyu Lee

Sung In Kim

An image sensor chip may include a first sub-chip, a second sub-chip on the first sub-chip, and an interconnector between the first and second sub-chips. The first sub-chip may include a first substrate, a bottom electrode on a first region of the first substrate, and a first capacitor on the bottom electrode. The first capacitor may include a plurality of first electrodes vertically extending from a top surface of the bottom electrode, a second electrode on the first electrodes, and a first dielectric layer between the second electrode and the first electrodes. The second sub-chip may include a pixel array configured to convert incident light into an electrical signal. The pixel array may be electrically connected through the interconnector to the first capacitor.

Image sensor chips having sub-chips

An image sensing system includes a pixel array, an analog-to-digital converter circuit, and a memory. The pixel array includes a first pixel, a second pixel, and a third pixel interposed between the first pixel and the second pixel. During a first sensing time, the analog-to-digital converter circuit converts a first image signal received from the first pixel to first image data and converts a second image signal received from the second pixel to second image data. During a second sensing time, the analog-to-digital converter circuit converts a third image signal received from the third pixel to third image data. The first image data and the second image data are written in the memory during a first write time, and the third image data are written in the memory during a second write time.

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Incheon, South Korea

Byung-Joon Baek