Samsung Electronics Co., Ltd.

Healthhub Co., Ltd.

Unisem Co., Ltd.

Byung Il Lee

Yusuf Cinar

Dae Woo Lee

Hyun Joon Yoo

Sung Hyun Kim

Kyoung Eun Lee

A storage device includes a memory module including a memory device, a module board including a memory controller configured to control the memory device, and a memory connector disposed on one side of the module board. The storage device also includes a first enclosure disposed on a first surface of the memory module, a second enclosure disposed on a second surface opposite to the first surface of the memory module, and a first sensor disposed on the first enclosure and configured to detect a state and provide a signal for the state to the memory controller. The first enclosure includes a first long side extending in a first direction and a first short side extending in a second direction perpendicular to the first direction. A ratio of the first long side to the first short side ranges from 1.2 to 3.5.

Storage device

The present invention relates to a method and system for assessing bone age using deep neural network, more specifically, in which regions of interest (ROIs) even for rotated objects can be more precisely and accurately extracted from an image by a rotated object detection technique used in region proposal networks. Thereby bones with different angles in the image can be detected with excellent speed and accuracy.

Method and system for assessing bone age using deep neural network

The present invention discloses a semiconductor wafer baking apparatus comprising a heating plate, a wafer guide, and an exhaust heat compensator. The heating plate is loaded with a wafer and the wafer guide arranges the wafer on the heating plate. The exhaust heat compensator is placed on the wafer guide and compensates exhausted heat from an edge area of the wafer. The exhaust heat compensator comprises a penetration hole to expose a center portion of the wafer. Therefore, the semiconductor wafer baking apparatus according to the present invention compensates the heat loss occurring in the edge area of the wafer and keeps the edge area of the wafer from temperature drop, which results in a temperature uniformity on the wafer surface. By reducing the temperature deviation within a wafer, a uniform pattern size of an entire wafer in the semiconductor wafer manufacturing process is achieved so that the process reliability and the process yields can be improved.

Semiconductor wafer baking apparatus

Growing community of inventors

Seoul, South Korea

Byung Il Lee