Samsung Electronics Co., Ltd.

Byung-gil Jeong

Dong-kyun Kim

Seok-Whan Chung

Jun-sik Hwang

Hyung-jae Shin

In-sang Song

Woon-bae Kim

Seog-woo Hong

Seok-whan Chung

Ji-Hyuk Lim

Suk-jin Ham

Min-seog Choi

Jong-oh Kwon

Chang-jung Kim

Jong-seok Kim

Yong-seop Yoon

Dong-sik Shim

Kyu-Dong Jung

Kae-dong Back

Sung-chan Kang

Hyung-joo Kim

A breast scanning apparatus which uses photoacoustic ultrasonic waves is provided. The breast scanning apparatus includes a body which includes a first hole and a second hole which are horizontally parallel to each other; a first compression plate and a second compression plate, at least one of which is movable in a vertical direction with respect to the body; a first sliding plate and a second sliding plate, which are respectively installed on surfaces of the first compression plate and the second compression plate and are facing each other and are movable in a first direction; a first ultrasonic transducer array in the first compression plate and facing the first sliding plate; and a first laser head in the first compression plate, which is movable in a second direction which is perpendicular to the first direction.

Breast scanning apparatus using photoacoustic ultrasonic wave

An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.

Electro acoustic transducer

A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.

Micromachined ultrasonic transducer array

A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.

Capacitive micro-machined ultrasonic transducer and method of singulating the same

An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.

Ultrasonic transducer structure, ultrasonic transducer, and method of manufacturing ultrasonic transducer

An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.

Ultrasonic transducer and method of manufacturing the same

Provided are a piezoelectric micro speaker having a piston diaphragm and a method of manufacturing the piezoelectric micro speaker. The piezoelectric micro speaker includes: a substrate having a cavity formed therein; a vibrating membrane that is disposed on the substrate and covers at least a center part of the cavity; a piezoelectric actuator disposed on the vibrating membrane so as to vibrate the vibrating membrane; and a piston diaphragm that is disposed in the cavity and performs piston motion by vibration of the vibrating membrane. When the vibrating membrane vibrates by the piezoelectric actuator, the piston diaphragm, which is connected to the vibrating membrane through a piston bar, performs a piston motion in the cavity.

Piezoelectric micro speaker having piston diaphragm and method of manufacturing the same

A cell of an ultrasonic transducer is provided. The cell includes a substrate; a supporting portion disposed on the substrate; a thin film spaced apart from the substrate and the supporting portion; and a connection portion which connects the supporting portion and the thin film. The connection portion may include a deformation portion that is elastically deformable. A channel of the ultrasonic transducer includes a plurality of cells arranged in an array. The ultrasonic transducer includes a plurality of channels arranged in an array.

Cell and channel of ultrasonic transducer, and ultrasonic transducer including the same

A piezoelectric microspeaker fabricated by a method including: forming a lower drive unit by forming a first drive electrode by depositing and etching a first thin conductive layer on a substrate, forming a first piezoelectric plate by depositing and etching a first piezoelectric layer on the first drive electrode, and forming a first common electrode by depositing and etching a second conductive layer on the first piezoelectric plate; after forming the lower drive unit, forming a diaphragm by depositing a non-conductive layer on the first common electrode; and forming an upper drive unit by forming a second common electrode by depositing and etching a third conductive layer on the diaphragm, forming a second piezoelectric plate by depositing and etching a second piezoelectric layer on the second common electrode, and forming a second drive electrode by depositing and etching a fourth conductive layer on the second piezoelectric plate.

Piezoelectric microspeaker and method of fabricating the same

Provided are a piezoelectric micro speaker and a method of manufacturing the same. The piezoelectric micro speaker includes: a substrate having a cavity therein; a diaphragm that is disposed on the substrate, the diaphragm including a vibrating membrane that overlaps the cavity; a piezoelectric actuator that is disposed on the vibrating membrane; and a weight that is disposed in the cavity and attached to a center portion of the vibrating membrane.

Piezoelectric micro speaker including weight attached to vibrating membrane and method of manufacturing the same

A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a device plate, a front plate bonded on a front surface of the device plate, and a rear plate bonded on a rear surface of the device plate. The device plate includes a diaphragm, a piezoelectric actuator that vibrates the diaphragm, and a front cavity disposed in front of the diaphragm. The front plate includes a radiation hole connected to the front cavity. The rear plate includes a rear cavity formed in a surface of the rear plate facing the piezoelectric actuator, and a bent hole connected to the rear cavity. A sound absorption layer is formed on an inner surface of the rear cavity and absorbs sound radiated backward from the diaphragm so as to suppress the sound from being reflected on the rear plate.

Piezoelectric micro speaker and method of manufacturing the same

A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes.

Piezoelectric micro speaker including annular ring-shaped vibrating membranes and method of manufacturing the piezoelectric micro speaker

A micro speaker includes a substrate having a cavity formed therein, a diaphragm formed on the substrate overlapping the cavity. The diaphragm includes a first vibration membrane formed in a first area corresponding to a center portion of the cavity and a second vibration membrane formed in a second area corresponding to an edge portion of the cavity and formed of material different from that used for the first vibration membrane. A piezoelectric actuator is formed including a first electrode layer formed on the first vibration membrane, a piezoelectric layer formed on the first electrode layer, and a second electrode layer formed on the piezoelectric layer, and first and second curved lead wires, respectively connected to the first and second electrode layers across the second area, which are symmetrical to the center of the piezoelectric actuator.

Piezoelectric micro speaker with curved lead wires and method of manufacturing the same

Provided are a piezoelectric micro-acoustic transducer and a method of fabricating the same. In the piezoelectric micro-acoustic transducer, a diaphragm is divided into a first region and a second region. The first region may be formed of a material capable of maximizing the exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region. Also, the second region has a corrugated shape.

Piezoelectric micro-acoustic transducer and method of fabricating the same

Provided are a piezoelectric microspeaker and a method of fabricating the same. In the piezoelectric microspeaker, a diaphragm includes a first region and a second region. The first region may be formed of a material capable of maximizing an exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region.

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Anyang-si, South Korea

Byung-gil Jeong