Hynix Semiconductor Inc.

Skhynix Inc.

Byung-Deuk Jeon

Young-Jun Yoon

Dong-Geum Kang

Sun-Jong Yoo

A semiconductor device includes a plurality of first pads, a plurality of data input and output units suitable for transmitting a data between a plurality of global lines and the plurality of first pads, respectively, a connection control unit suitable for coupling the plurality of first pads to each other in a test operation period, and a test operation unit suitable for controlling the plurality of data input and output units to transmit a test data in a set order through the plurality of first pads coupled to each other in the test operation period.

Semiconductor device

An apparatus for outputting data in a semiconductor integrated circuit includes a clock generation block configured to activate a first clock signal for outputting a data signal and a second clock signal for outputting a data strobe signal based on a predetermined timing, and a data output block configured to latch a pre-data signal and a pre-data strobe signal in response to the first clock signal and the second clock signal, respectively.

Apparatus and method for outputting data in semiconductor integrated circuit

A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.

Semiconductor integrated circuit

A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.

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Gyeonggi-do, South Korea

Byung-Deuk Jeon