Semiconductor Components Industries, LLC

Byoungok Lee

Seungwon Im

Oseob Jeon

Joonseo Son

Dukyong Lee

Changyoung Park

Yoonsoo Lee

Mankyo Jong

Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

Integrated circuit direct cooling systems having substrates in contact with a cooling medium

Semiconductor package having a spacer with a junction cooling pipe

Semiconductor package having junction cooling pipes embedded in substrates

In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.

Stray inductance reduction in packaged semiconductor devices and modules

Growing community of inventors

Bucheon-si, South Korea

Byoungok Lee