Samsung Display Co., Ltd.

Leland Stanford Junior University

Litton Systems, Inc.

Agency for Defense Development

Agency of Defense Development

Byoung Yong Kim

Jeong Ho Hwang

Jong Hyuk Lee

Herbert J Shaw

Dae Hyuk Im

Michel J Digonnet

Si Joon Song

Eui Jeong Kang

Jung Yun Jo

Keiichiro Toyama

Seung-soo Ryu

Kenneth A Fesler

Sang Duk Lee

Jeong Do Yang

Seung Soo Ryu

Shangyuan Huang

Dong Hyun Lee

Young Min Park

Bong Hyun You

Hyun Sup Lee

George A Pavlath

Seung Yong Song

Seung-Hwa Ha

Jean Ho Song

Dae Geun Lee

Su Jung Huh

Seung Hwa Ha

John J Fling

Seung Kyun Kim

Sang Hyeon Song

Jeong In Lee

Paul F Wysocki

Min Y Jeon

Ho J Jeong

Hyang K Kim

Yeon W Koh

Seok H Yun

Hebert J Shaw

A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.

Display device and method for manufacturing same

A display device including: a lower substrate including a plurality of first protrusions; a base substrate on the lower substrate, wherein the base substrate includes a plurality of second protrusions overlapping with the plurality of first protrusions, respectively; and a plurality of pad electrodes on the base substrate, wherein each of the plurality of pad electrodes includes a plurality of third protrusions overlapping with the plurality of second protrusions, respectively.

Display device and method for manufacturing the display device

A display apparatus includes: a display panel including a display area, and a pad area adjacent to the display area; and a circuit board attached to the pad area. The pad area includes at least one signal pad terminal electrically connected to a first signal line extending through the display area, and at least one dummy pad terminal spaced from the first signal line. The circuit board includes a signal lead terminal connected to the signal pad terminal, and a dummy lead terminal connected to the dummy pad terminal.

Display apparatus

A display panel according to one embodiment comprises: a display substrate that includes a display area and a pad area disposed around the display area, at least one pad terminal disposed on the substrate of the pad area, and an open portion which is at least partially and planarly surrounded by the pad terminal.

Display panel and display device comprising same

A display device includes: a display area; a non-display area around the display area; a substrate; and a first terminal in the non-display area on the substrate, the first terminal including: a plurality of first conductive patterns spaced apart from each other, an insulating layer covering each of the plurality of first conductive patterns, and a second conductive pattern on the insulating layer, covering the plurality of first conductive patterns, and including concave and convex portions on a surface thereof.

Display device

A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

Method of manufacturing display device including a formation process of a conductive film and laser curing the conductive film and manufacturing device for display device

A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.

Bonding apparatus and method for using the same

A display device includes a first substrate including a display area including pixels, a non-display area disposed around the display area, and a base substrate, a second substrate facing the first substrate, and a printed circuit board attached to side surfaces of the first substrate and the second substrate, wherein the first substrate includes a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction, and spaced apart from each other along a second direction intersecting the first direction, and a plurality of connection pads arranged on the side surface of the first substrate and the side surface of the second substrate, connected to the connection wirings, extending along a thickness direction, and spaced apart from each other along the second direction, the first substrate further includes a coupling member disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate, and the coupling member includes a non-conductive film portion disposed to overlap the connection wirings along the first direction, and a conductive film portion disposed around the non-conductive film portion.

A display device includes a substrate including a display area to display an image and a pad area positioned around the display area; a first pad unit disposed on the pad area, and including a first terminal region having a plurality of first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad unit positioned at one side of the base film, the second pad unit being coupled with the first pad unit by electrically connecting with the plurality of first pad terminals. Each of the plurality of first pad terminals includes: at least three first connection pad terminals arranged in a first row disposed at a first angle larger than 0&#xb0; and smaller than 90&#xb0; relative to the first direction, the plurality of first connection pad terminals being in electrically connecting with the second pad unit of the printed circuit board through a plurality of conductive balls; a plurality of second connection pad terminals spaced apart from the plurality of first connection pad terminals, and arranged in a second row disposed at a second angle larger than 0&#xb0; and smaller than 90&#xb0; relative to the first direction, the plurality of second connection pad terminals being in electrically connecting with the second pad unit of the printed circuit board through another plurality of conductive balls; and a plurality of first dummy pad terminals disposed between pairs of adjacent first connection pad terminals of the first connection pad terminals.

Display device having a plurality of pad terminals including connection pad terminals and dummy pad terminals

A display device includes: a substrate including a first surface and a second surface opposing each other; a display element and a signal line on the first surface; a first wire on the second surface and electrically connected to the signal line; a cover portion on the second surface; and a first driving unit on the second surface and electrically connected to the first wire. The first wire includes a portion exposed outside the cover portion, and the first driving unit is connected to the first wire at the portion of the first wire which is exposed outside the cover portion.

A display device includes a display panel. A flexible printed circuit board is electrically connected to the display panel. A first pad is disposed on the display panel. A second pad is disposed on the flexible printed circuit board and overlaps the first pad. A first anisotropic conductive film is disposed between the first pad and the second pad. The first anisotropic conductive film is configured to bond the first pad to the second pad. The first anisotropic conductive film includes a conductive polymer. The first anisotropic conductive film includes at least one first conductive region that electrically connects the first pad and the second pad and at least one first insulating region.

Display device and manufacturing method thereof

A display device according to an exemplary embodiment includes: a substrate including a display region configured to display an image, and a pad region positioned around the display region; and a first pad unit positioned on the pad region, wherein the first pad unit includes a first terminal region including a plurality of first pad terminals arranged in a first pattern, and a second terminal region including a plurality of second pad terminals arranged in a second pattern different from the first pattern.

High resolution display device

Growing community of inventors

Seoul, South Korea

Byoung Yong Kim