Lg Innotek Co., Ltd.

Ls Cable Ltd.

Ls Mitron Ltd.

Byoung-Un Kang

Joon-Mo Seo

Jae-Hoon Kim

Tae-Hyun Sung

Kyung-Tae Wi

Soon-Young Hyun

Jun-Woo Lee

Byoung-Kwang Lee

Dong-Cheon Shin

Chan-Young Choi

Ju-Hyuk Kim

Jai-Hoon Kim

A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Dicing die attachment film and method for packaging semiconductor using same

The present invention relates to a semiconductor packaging method. The method comprises (S) applying a die adhesive to an upper surface of a member through screen-printing; (S) B-stage curing the member having the die adhesive; (S) attaching a die on the B-stage cured die adhesive; (S) wire-bonding the die to the member; and (S) encapsulating the outside of the resultant, after the B-stage curing process of the step S, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step Sis performed such that the die adhesive maintains an adhesive strength of 10 kgf/cmor more at normal temperature after the die attaching.

Semiconductor packaging method

A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Dicing die adhesive film for semiconductor

Growing community of inventors

Yongin-si, South Korea

Byoung-Un Kang