Samsung Electronics Co., Ltd.

Byoung-Rim Seo

Yung-Cheol Kong

Seok-Won Lee

Jae-Cheon Do

Han-Sung Ryu

Jae-Cheon Doh

Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.

Camera module

An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.

Image sensor package and method of manufacturing the same

An image sensor module structure includes an image sensor package, a housing, and an underfiller. The image sensor package includes a substrate having interconnection pads formed on an outermost edge. The housing includes a filter projecting from a bottom surface of a housing body. The projecting filter is attached on an image sensor chip using various adhesive patterns. Further, the underfiller is formed in a space between the housing body and the image sensor package.

Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure

The invention involves an image sensor camera module and a method of fabricating the image sensor camera module. The image sensor camera module uses a single-body type lens holder defined by a hollow cylindrical body having a shoulder protruding radially inwardly from an inner surface thereof. First and second lenses therein are spaced apart by a first spacer and a filter therein is spaced from the second lens by a second spacer. An image sensor is adhered to a lower rim of the body, and the filter is adhered to an upper rim thereof. All optical elements within the lens holder thus are affixed in fixed relative position compatible with a predefined focal length and axis. Moreover, the adhesively sealed interior of the body of the image sensor camera module prevents particulate contamination.

Growing community of inventors

Seoul, South Korea

Byoung-Rim Seo