Hyundai Electronics Industries Co. Ltd.

Byoung Ju Kang

Wan Soo Kim

Min S Han

Tae Gook Lee

A method for forming a multi-level metal interconnection, comprising the step of forming a first metal interconnection over an underlying layer; forming an insulating layer having a selected thickness over the underlying layer including the first metal interconnection; etching the insulating layer to form a contact hole, thereby exposing the first metal interconnection; forming a metal plug in the contact hole to contact with the first metal interconnection; etching the insulating layer by a portion of the selected thickness; forming a pair of metal spacers in sidewalls of the metal plug over the insulating layer; and forming a second metal interconnection over the insulating layer to contact with the first metal interconnection through one of the metal spacers.

Growing community of inventors

Kyoungki-do, South Korea

Byoung Ju Kang