Samsung Electro-Mechanics Co., Ltd.

Clemson University

Sumitomo Electro-Mechanics Co., Ltd.

Byoung Hwa Lee

Min Cheol Park

Sang Soo Park

Young Ghyu Ahn

Dong Seok Park

Hae Suk Chung

Sung Kwon Wi

Eun Hyuk Chae

Kyo Kwang Lee

Heung Kil Park

Doo Young Kim

Chang Hoon Shim

Jin A Kim

Jin Man Jung

Hai Joon Lee

Tae Hyeok Kim

Jin Woo Lee

Chang Hoon Kim

Hyun Tae Kim

Soon Ju Lee

Young Hoon Song

Jeong Ho Yoon

Hae Sock Chung

Nam Chul Kim

Hwi Geun Im

Mi Hee Lee

Hong Yeon Cho

Young Key Kim

Sang Hoon Kwon

Hyung Joon Kim

Doo Il Kim

Seok Hyun Yoon

Hyun Ju Yi

Seung Heon Han

Han Wool Ryu

Hyun Cheol Oh

Kyu Ree Kim

Min Kyoung Kwon

Bae Gen Lee

Dong Hwan Lee

Seung Eun Lee

Kang Heon Hur

Young Seuck Yoo

Hyun Hee Gu

Doo Hwan Lee

Jung Wook Seo

Yul Kyo Chung

Sung Hyung Kang

Seok Kyoon Woo

Dae Bok Oh

Hwan Soo Lee

Byung Jun Jeon

Jae Hyuk Choi

Hong Kyu Shin

Hyung Jin Jeon

Du Won Choi

Moon Il Kim

Yee Na Shin

Eun Sang Na

Young Do Choi

Hyo Jung Kim

Min Sung Song

Byung Taek Kim

Hyeog Soo Shin

Kun Ho Koo

Kyung Nam Hwang

Todd Hubing

Jin Ho Ku

Seon Woo Oh

Oh Choon Kwon

Kwang Sun Choi

Eun Hye Choi

Hyo Chan Oh

Haixin Ke

Kyong Nam Hwang

Ho Cheol Kwak

Hiroki Sato

James Mike Peters

Myung Pyo Jun

Ian Lee

There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as &#xbd; of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as &#xbd; of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063&#x2264;(B+C)/A&#x2264;1.745.

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

Inductor

There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as 1/2 of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as 1/2 of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063&#x2264;(B+C)/A&#x2264;1.745.

A coil component includes a support member, an internal coil supported by the support member, and external electrodes connected to the internal coil. The external electrodes may each include a first layer coming into contact with the internal coil and a second layer disposed on a surface of the first layer. The first layer may serve as a buffer layer for improving a contact property between the internal coil and the external electrode. The second layer may be disposed to come into at least partial contact with a first end portion of the support member and a second end portion of the support member.

Coil component

A coil component includes a body having a coil part disposed therein and an external electrode connected to the coil part. The body includes magnetic particles, and the magnetic particles include first magnetic particles, second magnetic particles, and third magnetic particles. A diameter of each of the first, second, and third magnetic particles is different from each other.

Coil component and method of manufacturing the same

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5&#x2264;T/T&#x2264;2.0, and when the thickness of a central portion of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, 0.9&#x2264;T/T&#x2264;0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained.

Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044&#x2264;LG*log [1/AT]&#x2264;0.00150.

Multilayer ceramic capacitor and board having the same

A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042&#x2264;(B+C)/A&#x2264;1.537 is satisfied.

Multilayer ceramic capacitor and mounting board therefor

A multilayer capacitor and a board having the same includes external electrodes and internal electrodes. The external electrodes include connection portions formed on a mounting surface of a capacitor body and band portions formed on side surfaces of the capacitor body, and the internal electrodes include body portions overlapping each other and lead portions extended from the body portions to the mounting surface of the capacitor body, to thereby be connected to the connection portions of the external electrodes. The body portions are formed to be spaced apart from virtual lines connecting distal ends of the connection portions and distal ends of the band portions to each other.

Multilayer capacitor and board having the same

A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.

Composite electronic component, board having the same, and power smoother including the same

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Gyunggi-do, South Korea

Byoung Hwa Lee