Samsung Electro-mechanics Co., Ltd.

Byoung-Ho Rhee

Dek-Gin Yang

Young-Sang Cho

Young-Woo Kim

Kyu-Hyok Yim

Keun-Ho Kim

Sang-Won Ha

Kyoung-Up Shin

Dong-Hwan Lee

Bum-Young Myoung

Yang-Je Lee

Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.

Printed circuit board including waveguide and method of producing the same

Disclosed is an optical printed circuit board (PCB) for long-distance signal transmission, which is combined with fiber blocks and pipe blocks embedded in opto-via holes to form a multi-layered optical PCB, and transmits an optical signal using a fiber ribbon when an optical signal transmission distance between layers constituting the multi-layered optical PCB is longer than a length of an optical waveguide element used in conjunction with a silicon substrate. The optical PCB comprises a base substrate including an insulating material, a copper foil, and an opto-via hole, and an optical signal transmission member attached to the base substrate to horizontally transmit an optical signal. An optical signal connection member is horizontally connected to the optical signal transmission member to transmit the optical signal across a desired distance. Therefore, an optical PCB of the present invention is advantageous in that an optical waveguide, a pipe block, and a fiber block are horizontally and optionally arranged and attached to each other, thereby transmitting an optical signal across a longer distance than a length of a silicone substrate.

Optical printed circuit board for long-distance signal transmission

Disclosed herein are a brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface, and a method for improving adhesion of a polyimide surface by applying the composition to a brown oxide process. The brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface comprises, 5&#x2dc;15 g/L of an amine; 190&#x2dc;210 g/L of a hydroxide compound; at least one additive selected from 3&#x2dc;6 g/L of a cleaner adjuvant, 0.1&#x2dc;5 g/L of a antifoaming agent and 1&#x2dc;10 g/L of a precipitation inhibitor; and the balance of water. When the brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface is applied to a pretreatment step of a brown oxide process, it can clean a copper surface and improve adhesion of a polyimide surface.

Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process

The present invention discloses a multi-layer Printed Circuit Board (PCB) and method for coupling block type multichannel optical signals, the method including the steps of i) forming one or more first optical via holes to allow one or more first optical signal coupling blocks to be inserted therein, ii) aligning a first optical waveguide and the first optical signal coupling blocks so that the first optical waveguide is interconnected to the first optical signal coupling blocks via an optical signal, iii) attaching a first fixing guide to a base board to fasten the first optical signal coupling blocks, iv) removing the first fixing guide and forming one or more second optical via holes to allow one or more second optical signal coupling blocks to be inserted therein, and v) repeatedly performing steps i) to iv) as many times as a number of layers of the multi-layer PCB.

Multi-layer PCB and method for coupling block type multichannel optical signals

Disclosed herein is a method of measuring a dielectric constant of a Printed Circuit Board (PCB) for a Rambus Inline Memory Module (RIMM), which includes the steps of measuring a length of a Rambus product of a PCB, applying an input waveform to the Rambus product at a certain probing position and obtaining a cross point of rising times of the input waveform and an output waveform generated by reflection of the input waveform, obtaining time corresponding to the cross point, and calculating a dielectric constant by substituting the measured length of the Rambus product and the obtained time for corresponding variables of a dielectric constant calculating equation.

Method of measuring dielectric constant of PCB for RIMM

Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.

Growing community of inventors

Daejeon, South Korea

Byoung-Ho Rhee