Samsung Electronics Co., Ltd.

Byong-wook Na

Ho-Cheol Lee

Hyong-Ryol Hwang

Kwun-soo Cheon

Provided are a semiconductor chip including a TSV passing through a transistor, and a stack module and a memory card using such a semiconductor chip. The semiconductor chip may include a semiconductor layer that has a first surface and a second surface opposite to each other. A conductive layer may be disposed on the first surface of the semiconductor layer. A TSV may pass through the semiconductor layer and the conductive layer. A side wall insulating layer may surround a side wall of the TSV in order to electrically insulate the semiconductor layer and the conductive layer from the TSV.

Semiconductor chip, stack module, and memory card

A semiconductor memory device includes a row path circuit, a reset signal generating circuit and a column path circuit. The row path circuit is initialized in response to a power-up signal. The reset signal generating circuit delays the power-up signal to generate a column reset signal. The column path circuit is initialized in response to the column reset signal. The semiconductor memory device can reduce a peak value of a surge current by initializing a row path circuit and a column path circuit at different time points. Therefore, the semiconductor memory device may have a relatively short setup time of an internal power supply voltage.

Growing community of inventors

Anyang-si, South Korea

Byong-wook Na