Samsung Electronics Co., Ltd.

Byeoung Ju Ha

Hoon Song

Yong-soo Oh

Young-ki Hong

Kyung-Il Cho

Mun-cheol Choi

Hyun-cheol Kim

Seog-soon Baek

In-seob Song

Sang-young Son

Sung-gyu Kang

Jong-beom Kim

Hye-jung Cho

Hayong Yun

A capillary pumped loop system includes an evaporator for vaporizing a refrigerant by absorbing heat from the periphery, a condenser for turning the vaporized refrigerant into a liquid by radiating heat from the vaporized refrigerant, a tube for forming a circulatory path connecting the evaporator to the condenser, and a capillary unit installed to form a plurality of gaps within the tube so that the refrigerant can move along the circulatory path due to capillary action caused by the gaps. Accordingly, when the refrigerant passes through the capillary unit due to the capillary action, bubbles in the tube can be reduced. In addition, a multi-path is formed for the movement of the liquid refrigerant, so discontinuation of the refrigerant can be prevented, thereby preventing the refrigerant in the evaporator from drying out.

Capillary pumped loop system

A heat transferring device having an adiabatic unit is provided. The heat transferring device includes a lower plate including an evaporator which contacts a heating element and allows a liquid refrigerant to absorb heat transferred from the heating element to thus evaporate, a condenser in which gas flowing from the evaporator is condensed, a gas passage through which the gas flowing from the evaporator into condenser, a liquid refrigerant passage through which the liquid refrigerant flows from the condenser into the evaporator and which includes a portion used as a channel region bordering the evaporator, and an adiabatic unit provided between the liquid refrigerant passage and the gas passage so that elements hindering the flow of the liquid refrigerant can be prevented from being introduced from the gas passage into the liquid refrigerant passage; and an upper plate which contacts some members of the lower plate including the adiabatic unit.

Heat transferring device having adiabatic unit

A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity region, and a manifold region surrounding the capillary region. The capillary region has a capillarity generator capable of generating capillary action, and a top plate is configured to include an exhaust unit including a gas collector to exhaust a gas coolant generated in the vaporization cavity region. The evaporator can be implemented as a small and thin cooling device for performing cooling without external power. Furthermore, the evaporator can effectively prevent degradation of fluid flow force due to coexistence of gas and liquid by isolating a liquid coolant from a vaporized coolant by a capillary region, thereby significantly improving heat exchange characteristics.

Flat evaporator

A plate type condenser used in a cooling system is provided. The plate type condenser includes a casing for defining an upper space into which a gaseous refrigerant flows and is cooled, a lower space for accommodating a liquid refrigerant into which the gaseous refrigerant is condensed, and a connecting portion through which the upper and lower spaces communicate with each other. The casing substantially has a plate shape. A refrigerant inlet is installed at an upper portion of the casing to communicate with the upper space. A refrigerant outlet is installed at a lower portion of the casing to communicate with the lower space. A first adiabatic slit for separating the walls of the casing is formed between the upper space and the lower space except at the connecting portion. Accordingly, since the first adiabatic slit prevents heat in the upper space from being conducted to the lower space through the walls of the casing, a liquid refrigerant in the lower space can be satisfactorily cooled without using an additional subcooler.

Plate type condenser

A microgyroscope with two resonant plates is provided. The microgyroscope includes a substrate; first and second frames provided on the substrate to have a predetermined height, the first and second frames facing each other; a plurality of anchors supporting the first and second frames with respect to the substrate; first and second resonant plates provided between the first and second frames to be separated from each other by a predetermined distance; and a matching link unit connected to the first and second resonant plates so that it links the motion of one resonant plate to the motion of the other resonant plate such that the matching link unit is moved by the motion of one resonant plate in a first direction and then moves the other resonant plate in a second direction opposite to the first direction. In the microgyroscope, the difference between the resonance frequencies of the two resonant plates is removed by a self resonant matching structure implemented by the matching link, so that the range of an allowable process error is large, and the microgyroscope can be easily manufactured. Additionally, the reliability and the linearity of a resonance structure are improved. Since the driving beam and the sensing beam are separately designed, mode coupling can be prevented, thereby increasing the sensing sensibility.

Microgyroscope with two resonant plates

A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second wafer to the multilayered stack; polishing the first wafer to a predetermined thickness; forming a MEMS structure in a vacuum area of the first wafer and a pad outside the vacuum area, the MEMS structure and the pad being connected to the signal line; forming a structure in a third wafer to have space corresponding to the vacuum area of the MEMS structure; and bonding the third wafer to the polished surface of the first wafer in a vacuum state. For protection of the structure and maintaining a vacuum level required for operation, the fabricated structure is vacuum-packaged at the wafer level, thereby improving the yield of fabrication. In addition, since a special vacuum packaging process is not necessary, the fabrication can be simplified.

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Kyungki-do, South Korea

Byeoung Ju Ha