Seoul National University

Samsung Electronics Co., Ltd.

Korea Institute of Science and Technology

Byeongmoon Lee

Yongtaek Hong

Eunho Oh

Junghwan Byun

Heesuk Kim

Phillip Lee

Seungjun Chung

Sujin Jeong

Hyungsoo Yoon

Jai Kyeong Kim

Jeong Gon Son

Seunghyun Lee

Jaikyeong Kim

Daesik Kim

JeongGon Son

Youngpyo Ko

Hyunjoo Cho

Hyeon Cho

Provided is a method of manufacturing a stretchable substrate according to various embodiments of the present disclosure in order to implement the above-described objects. The method may include forming an auxetic including a plurality of unit structures and forming one or more microstructures.

Stretchable substrate and method of manufacturing the same

A pressure sensor includes: a first substrate; a second substrate having an inner surface and a touch surface that is opposite to the inner surface, wherein the inner surface faces the first substrate with a resistance sensing space therebetween; a first electrode and a second electrode, which are arranged spaced apart from each other in the resistance sensing space; and a piezoresistive pattern arranged between the first electrode and the second electrode and disposed in the resistance sensing space, wherein the piezoresistive pattern includes a porous elastic support and a plurality of conductive carbon structures dispersed in the porous elastic support.

Pressure sensor, pressure sensor pixel array including pressure sensor, and electronic system including pressure sensor

The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

Electronic device and method of transferring electronic element using stamping and magnetic field alignment

A stretchable sensor includes a stretchable layer including an elastomer, and a conductive layer at least partially buried in the stretchable layer and including a conductive nanostructure. The stretchable layer includes a plurality of first regions including a ferromagnetic material buried in the elastomer, and a second region excluding the plurality of first regions.

Stretchable sensor and method of manufacturing the same and wearable device

A method of manufacturing a paste according to various embodiments of the present disclosure for resolving the above-described problems is disclosed. The method of manufacturing a paste may include an operation of adding a metal conductor and a multi-walled carbon nanotube (MWCNT) to chloroform (CHCl) to produce a first mixture, an operation of adding polydimethylsiloxane (PDMS) to the first mixture to produce a second mixture, an operation of evaporating the chloroform in the second mixture to acquire a third mixture, and an operation of adding an additional additive to the third mixture to produce a paste.

Paste manufacturing method and flexible electrode manufacturing method using the same

Disclosed is a stretchable substrate including: a via configured to provide an electrical connection between one surface and the other surface of the stretchable substrate; and a buffer shell positioned between the via and the stretchable substrate and having a Young's modulus value that is greater than a Young's modulus value of the stretchable substrate and smaller than a Young's modulus value of the via.

Method for forming flexible substrate including via, and flexible substrate having via

Disclosed is an apparatus for fabricating a stretchable electrical circuit, including: a stretching device configured to stretch a mounted stretchable substrate in two different directions; a marking device configured to mark a mark on the stretchable substrate; an image device configured to obtain an image of the stretchable substrate on which a plurality of alignment marks are marked by the marking device; and a control device configured to control the stretching device, the image device, and the marking device. The control device forms a first axis and a second axis using the plurality of alignment marks marked on the image obtained by the image device and marks one point of a surface of the stretchable substrate with coordinates made by the first axis and the second axis using the first axis and the second axis.

Apparatus for fabricating stretchable electrical circuit

A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.

Disclosed herein are a method of fabricating a stretchable electrical circuit and an apparatus for fabricating a stretchable electrical circuit, wherein the method of fabricating a stretchable electrical circuit includes stretching a stretchable substrate, forming a plurality of alignment marks on a surface of the stretchable substrate, forming a first axis extending from a line connecting two alignment marks among the plurality of alignment marks, and a second axis perpendicular to the first axis, marking one point of the surface of the stretched stretchable substrate with coordinates made by the first axis and the second axis, and disposing electrical components using the coordinates.

Growing community of inventors

Cheongju-si, South Korea

Byeongmoon Lee