Samsung Electronics Co., Ltd.

Byeonghwan Youm

Kyung Bin Kim

Gi-Uk Gang

Jinu Kim

Nak-Chung Choi

Disclosed is an electronic device having a housing and including an antenna device, and a method of manufacturing the housing. When the antenna device requiring a plating process is applied to the housing, the housing has an antenna and provides exterior deposition and visual enhancement to the electronic device.

Housing including antenna, manufacturing method of housing, and electronic device having housing

Various embodiments of the present disclosure may provide an electronic device that includes: a first cover configured to form a first surface of the electronic device; a second cover configured to form a second surface of the electronic device, the second cover being opposite to the first surface; a conductive sidewall configured to surround at least a part of a space formed between the first cover and the second cover; a conductive member located in the space and configured to integrally extend from the conductive sidewall, the conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a non-conductive member located in the space to make contact with the conductive member, the non-conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a conductive pattern disposed on the second surface of the non-conductive member and electrically connected to the conductive member; and a conductive structure disposed between the conductive pattern and the conductive member to electrically connect the conductive pattern to the conductive member. The non-conductive member may include a via hole that at least partially passes through the area between the first surface and the second surface thereof, and the conductive structure may include a first part having a first cross-sectional area and a second part having a second cross-sectional area that is larger than the first cross-sectional area, wherein at least a part of the conductive structure may be disposed within a through-hole of the non-conductive member, and the second part may be disposed closer to the second surface of the non-conductive member than the first part. Various other embodiments are possible.

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Gyeonggi-do, South Korea

Byeonghwan Youm