Lumens Co., Ltd.

Byeonggeon Kim

Seunghyun Oh

Sungsik Jo

Junghyun Park

Seunghoon Lee

An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.

LED pixel device having chip stack structure

A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

Light emitting element and method for fabricating the same

An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.

LED package

An LED module is disclosed. The LED module includes: light sources elongated in a first direction; a mount supporting the light sources; and a composite reflector integrated with the mount to guide light received from the light sources. The composite reflector includes a first region arranged adjacent to the light sources to reflect light in a second direction substantially orthogonal to the first direction, a third region arranged away from the mount to reflect light in the second direction substantially orthogonal to the first direction, and a second region whose portions overlap the first region and the third region and formed with a plurality of diffraction lines through which light is diffused in the second direction. The diffraction lines formed on the composite reflector diffract incident light and direct the diffracted light toward the light receiving unit.

Growing community of inventors

Yongin-si, South Korea

Byeonggeon Kim