Korea Advanced Institute of Science and Technology

Seoul National University

Byeong-Soo Bae

Ji-Hoon Ko

Gwang-Mun Choi

SeungCheol Yang

Jung-Hwan Kim

Woo-Soo Kim

Dong-Jun Kang

JungHo Jin

Tae-Woo Lee

Young-Hoon Kim

Young Hwan Hwang

Joon-Soo Kim

Young-joo Eo

Jeong-Hwan Kim

Tae-Ho Lee

Kyung-Ho Jung

Jin-Ki Kim

Jun-young Bae

Seung Cheol Yang

Seung-Mo Kang

Hwea Yoon Kim

Seung-Yeon Kwak

Jun-Ho Jang

Junho Jang

Ji Hoon Ko

Provided is a curable siloxane composition with low dielectric constant and low dielectric loss, in which organic alkoxy silane having a silicon-based asymmetric structure and organic alkoxy silane having a silicon-based symmetric structure are included. The curable siloxane composition has low dielectric constant and dielectric loss in a high frequency range, low water absorption, excellent workability, and high copper foil peel strength, and thus physical properties suitable for application to printed circuit boards for high-frequency communication electronic devices may be provided.

Curable siloxane resin composition

Disclosed are a perovskite color converter and a method for manufacturing the same. In order to maintain strong physical properties, the siloxane resin is synthesized in two steps. The silane precursor performs siloxane bond through a non-aqueous sol-gel reaction to form a siloxane resin, and a bond between methacrylate group, and a bond between methacrylate group and an organic ligand are formed through a secondary cross-linking reaction.

Perovskite color converter and method of manufacturing the same

The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.

Siloxane hard-coating resin composition

The present invention relates to a method for preparing a semiconductor nanocrystal siloxane composite resin composition, and a cured product using the same. In the preparation method, the semiconductor nanocrystals are added during a non-hydrolytic sol-gel condensation reaction for forming a siloxane structure so that a siloxane resin having a dense inorganic network, which includes a siloxane bond, is encapsulated and thus is dispersed in the semiconductor nanocrystals through a chemical interaction and a chemical bond, thereby preventing a reduction in inherent characteristics (quantum efficiency) of the semiconductor nanocrystals resulting from an external oxidizing environment. Accordingly, when the curing of the resin composition is carried out, a cured product, which can be applied to various applications including a semiconductor nanocrystal siloxane composite having excellent reliability, can be provided.

Method for preparing semiconductor nanocrystal siloxane composite resin composition

The present disclosure relates to a hard-coating cured material which contains a siloxane resin component including an epoxy group and a preparing method of the hard-coating cured material. Especially, by using a special polymerization method like a cationic polymerization and a moisture-heat treatment, it is possible to provide a hard-coating film having both superior flexibility and high surface hardness that cannot be obtained from conventional coating compositions.

Hard coating film using composition including epoxy siloxane resin and preparing method thereof

The invention relates to a transparent flexible hard coated film and a method of producing the same, and more particularly, to a transparent flexible hard coated film including a scratch-resistant surface and a method of producing the same.

Transparent flexible hard coated film and method of producing the same

The present invention relates to a siloxane hard resin including alicyclic epoxy siloxane alone or a reactive monomer, which is prepared by condensation reaction of alkoxysilanes, and has a weight average molecular weight in the range of 1000 to 4000 and a molecular weight distribution of PDI 1.05 to 1.4. A siloxane hard cured article produced by photo- or thermal polymerization has high hardness by compact crosslinking of siloxane molecules having different molecular weights.

Siloxane hard coating resin

The present application relates to a hard-coating resin composition including a siloxane resin, a preparing method of a siloxane cured hard-coating article using same and an optical film including the siloxane cured hard-coating article.

Provided is a photo-curable transparent resin in which an oxetane monomer for promotion of photo-curing, control of viscosity, and improvement of physical properties is mixed with a photo-cationically polymerizable cyclo-aliphatic epoxy group-containing oligosiloxane resin prepared by a sol-gel reaction. The photo-cationically polymerizable photo-curable transparent resin added with the oxetane monomer provides a cured product having high curing density and retaining excellent mechanical properties, thermal-mechanical properties, and electrical properties.

Photo-curable transparent resin composition

The present disclosure relates to a thermally resistant optical siloxane resin composition including siloxane containing photo-cationically polymerizable epoxy group, a photo initiator, and an antioxidant.

Thermally resistant optical siloxane resin composition

Disclosed is a method of fabricating a flexible device, which includes surface-treating one or both sides of a carrier plate so that regions with different surface-treatments are formed on the same side of the carrier plate, forming a glass-filler reinforced plastic substrate film on the surface-treated carrier plate, forming thin film patterns on the glass-filler reinforced plastic substrate film, and separating the glass-filler reinforced plastic substrate film having the thin film patterns formed thereon from the carrier plate, and in which the surface-treating of the carrier plate enables the glass-filler reinforced plastic substrate film to be easily separated from the carrier plate without an additional process such as using a solvent or a laser release technique.

Fabrication method of flexible devices

The present invention provides a fluorescent dye-silane hybrid resin manufactured by polycondensing an alkoxysilane bonded with a fluorescent dye with an organo-silane. More particularly, the present invention provides a fluorescent dye-siloxane hybrid resin that is manufactured by reacting a fluorescent dye having one or more functional groups with an alkoxysilane having an organic functional group to form an alkoxysilane bonded with the fluorescent dye and then polycondensing the alkoxysilane bonded with a fluorescent dye with an organo-silanediol and an organo-alkoxysilane having a thermocurable or ultraviolet-curable functional group without water. The fluorescent dye-silane hybrid resin has excellent thermostability, photostability, fluorescence characteristics, and processibility.

Fluorescent dye-siloxane hybrid resin

A transparent siloxane resin composition for optical applications is provided including: (1) a vinyl-oligosiloxane hybrid prepared by a non-hydrolytic condensation reaction of an organoalkoxysilane having a vinyl group or a mixture of an organoalkoxysilane having a vinyl group and a metal alkoxide with an organosilanediol; (2) an organohydrosilicone compound having two or more silicon-bonded hydrogen atoms; and (3) a metal catalyst. The resulting transparent siloxane resin exhibits excellent light transmittance, light resistance and heat resistance, has refractive index and hardness suitable for optical applications, including optical devices, displays, LEDs or the like, and experiences little contraction during processing.

Transparent siloxane resin composition for optical applications

Provided is a solution composition for manufacturing a metal oxide semiconductor including aluminum salts, metal acetylacetonate and a solvent. In addition, provided is a method for manufacturing a metal oxide semiconductor, including: manufacturing of a metal oxide semiconductor by performing heat treatment after coating a solution composition for manufacturing the metal oxide semiconductor above a substrate. In addition, provided is a thin film transistor, including: a gate substrate; a metal oxide semiconductor manufactured to be overlapped with the gate substrate; a source electrode electrically connected to the metal oxide semiconductor; and a drain electrode that is electrically connected to the metal oxide semiconductor and faces the source electrode.

Solution composition for manufacturing metal oxide semiconductor

Provided is a non-hydrolytic transparent composite composition having excellent transparency and heat resistance, and a low thermal expansion coefficient. Particularly, the transparent composite composition includes a glass filler dispersed in a crosslinked transparent resin produced by a non-hydrolytic reaction. The non-hydrolytic transparent siloxane resin is a resin having Si&#x2014;O (siloxane) bonds, a resin having at least one kind of heterometal bonds, including Si&#x2014;O bonds, or the resin further containing other ingredients. When the transparent siloxane resin produced by a non-hydrolytic reaction forms a composite in combination with the glass filler, the composite realizes high transparency and heat resistance, as well as a low thermal expansion coefficient. Therefore, the transparent composite composition is useful as a substrate for thin film transistor (TFT) devices, display devices and optical devices.

Growing community of inventors

Daejeon, South Korea

Byeong-Soo Bae