Korea Institute of Science and Technology

Korea University Industrial Academic Collaboration Foundation

Samsung Electronics Co., Ltd.

Sns Revolution Co., Ltd.

Byeong Kwon Ju

Myung Hwan Oh

Yun Hi Lee

In Sang Song

Duck Hwan Kim

Jea Shik Shin

Ho Soo Park

Jae-Sung Rieh

Nam Yang Lee

Yun Kwon Park

Sang Uk Son

Sung Woo Hwang

Hee Tae Kim

Dong Hoon Hwang

Jae Sung Rieh

Dong Ky Shin

Kyung Sub Shin

Jae Shik Shin

Kwang Nam Kang

Yoon Taek Jang

Man Ho Song

Keun Ha Koh

Cheol Ho Yeo

Woo Beom Choi

A method of fabricating a nano resonator, includes forming a line pattern in a first substrate, and transferring the line pattern to a second substrate including a gate electrode. The method further includes forming a source electrode and a drain electrode on the transferred line pattern.

Apparatus and method for fabricating nano resonator using laser interference lithography

A nano resonance apparatus includes a gate electrode configured to generate a magnetic field, and a nanowire connecting a source electrode to a drain electrode and configured to vibrate in the presence of the magnetic field. The nanowire includes a protruding portion extending in a direction of the gate electrode.

Nano resonance apparatus and method

A resonator and a method for manufacturing a resonator are provided. The method may include doping a wafer, and forming on the wafer a substrate, a drain electrode, a source electrode, a gate electrode, and at least one nanowire.

Resonator having terminals and a method for manufacturing the resonator

Disclosed herein are an apparatus for measuring the total acid number of oil, an apparatus for measuring the lifetime of oil through the measurement of the total acid number of oil, a method for measuring the total acid number of oil, and a method of making measurements using an oil sensor. According to the disclosed invention, measurement accuracy can be increased through the use of a high-sensitivity conductance measuring sensor, the inventive apparatus can be applied to both lubricant oil and insulating oil, the size of the total acid number-measuring apparatus can be reduced.

Apparatus for measuring total acid number of oil and estimating lifetime of oil, and method for measuring total acid number of oil and oil sensor using the same

A selective and parallel growth method of carbon nanotube for electronic-spintronic device applications which directly grows a carbon nanotube on a wanted position toward a horizontal direction comprises the steps of: forming an insulating film on a board; forming fine patterns of catalyst metal layer including a contact electrode pad on the insulating film, forming a growth barrier layer for preventing vertical growth on upper part of the catalyst metal layer; and directly growing the carbon nanotube between the catalyst patterns.

Parallel and selective growth method of carbon nanotube on the substrates for electronic-spintronic device applications

A field emission display and a method for fabricating the same are disclosed. The method includes the steps of: forming a silicon mold; growing a diamond on the silicon mold, to form a diamond tip; forming a conductive layer on the diamond tip; bonding a first substrate to the conductive layer; removing the silicon mold; forming a gate insulating layer and gate electrode on the diamond tip; and etching the gate electrode and gate insulating layer to expose an electron emission portion of the tip, and thereby form a gate hole. By doing so, the operation voltage is reduced, compared with the diode-type display, and high-responsibility field emission display can be realized by applying (-) or (+) voltage to the gate electrode.

Method for fabricating a field emission display

In the present invention, the vacuum packaging of a field emission display (FED) is achieved in a high vacuum apparatus using a glass-to-glass bonding. The apparatus may eliminate the problems encountered in the conventional art in which a ventilation tube is used, so that vacuum degree of the interior of panels of the FED is affected (decreased) by the gases generated in sealing the ventilation tube. Furthermore, in the prior art, a part of the ventilation tube remains on the panel of the FED for thereby increasing the thickness of the panels, and the ventilating of gases is not effectively performed by the extension of the tube and a big size hole. The vacuum packaging apparatus of the FED and method therefor according to the present invention are capable of more effectively packaging FED by implementing a glass-to-glass bonding by ventilating gases from the interior of the panel of the FED in a manner of a high temperature ventilation in a high vacuum apparatus, contacting a glass substrate piece with a hole formed in the panel of the FED and applying a DC voltage thereto. Therefore, it is possible to easily implement a vacuum packaging of the FED and vacuum degree of the interior of the FED panel may be increased.

Vacuum packaging apparatus for a field emission display and a method

A field emission display device and a fabrication method thereof, by which a vacuum sealing can be simple, and electric and optical characteristics between pixels can be improved by achieving a device package by means of a junction between substrates in vacuum without a spacer, which includes a semiconductor substrate having a groove having a predetermined depth; an n-well formed on the semiconductor substrate under the bottom of the groove; an emitter formed on the n-well; an insulation film formed on a portion of the semiconductor substrate, in which the groove is not formed; a transparent electrode bonded to the upper portion of the insulation film; a light emitting layer arranged on the upper portion of the emitter and formed within the transparent electrode; and a glass substrate formed on the transparent electrode.

Field emission display device

An improved field emission display device fabrication method which adopts both a silicon wafer direct bonding method and a mold method so as to fabricate an improved field emission display device, which includes the steps of a first step which forms a tip array by a molding method; and a second step which bonds the tip array to a second semiconductor substrate.

Field emission display device fabrication method

A method for fabricating a luminant for a field emission display fabricated through PVD is disclosed. The method includes the steps of: forming a ZnO:Zn luminescent thin film on a glass substrate through PVD; and forming a conductive thin film on the ZnO:Zn luminescent thin film, to thereby change the luminescence threshold, brightness and luminescent color suitable for the operation characteristics of the emitter in a predetermined range, by controlling the thickness of the luminescent layer, temperature and ambient of heat treatment of the luminant.

Luminant for field emission display fabricated through physical vapor

A micro-tip for emitting an electric field and a method for fabricating the same are disclosed. The method includes the steps of: forming a silicon mould; forming a functional layer on the silicon mould, and then forming a tip on the functional layer; forming a conductive thin film on one side of the tip; bonding a substrate to the conductive thin film; and removing the silicon mould, to thereby obtain the structural advantages of the semiconductor tip as well as the advantages of the material for functional layer, and realize the micro-tip for an emitting electric field having high reliability.

Micro-tip for emitting electric field and method for fabricating the same

A fabrication method for a test piece for observing non-contact regions in a pair of bonded semiconductor substrates includes thinning one substrate of a pair of bonded semiconductor substrates, grade-polishing the thinned semiconductor substrate and the bonded semiconductor substrates to have a predetermined graded angle relative their bonded surfaces, and dry-etching an area around the bonded surfaces of the grade-polished semiconductor substrates to reveal faults. With the thusly fabricated test piece, micro non-contact regions can be simply observed and crystal faults existing on the bonded surfaces as well as in the micro non-contact regions can be easily detected.

Fabrication method of semiconductor test piece

A silicon fusion bonding method and apparatus for bonding silicon substrates in wet oxygen atmosphere. The method comprises a stabilizing step of the silicon substrates, which has been processed in a pre-process, in the wet oxygen atmosphere, a primarily bonding step of the silicon substrates to each other and a heat-treating step of the silicon substrates at a high temperature in the wet oxygen atmosphere in order to remove micro-gaps from a junction interface by virtue of filling-up effect of micro-gaps by interfacial oxide growing. The present apparatus includes a hollow quartz tub having a stabilization part and a heat-treating part, a flask for providing the wet oxygen atmosphere for the quartz tub, a heater for heating the heat-treating part of the quartz tub and a movable carrier for moving between the stabilization and heat-treating parts of the quartz tub as carrying thereon the silicon substrates in such a manner that the silicon substrates are spaced apart from each other with a quartz spacer interposed therebetween when they are stabilized and come into contact with each other by removing of the quartz spacer when they are heat-treated.

Growing community of inventors

Seoul, South Korea

Byeong Kwon Ju