Samsung Electronics Co., Ltd.

Byeong-Kuk Park

Sang-Yoon Kim

Masato Kajinami

Yoshiaki Yukimori

Seung Dae Seok

Hui-Jae Kim

Byeong Kap Choi

Jae Bong Shin

Byung Joon Lee

A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Semiconductor manufacturing apparatuses comprising bonding heads

Growing community of inventors

Asan-si, South Korea

Byeong-Kuk Park