Sk Microworks Co., Ltd.

Byeong Jae Lim

Young Min Heo

Jewon Yeon

The present disclosure relates to a polyester resin composition including a polyester resin including a diol residue and a dicarboxylic acid residue, wherein the diol residue includes a cyclohexanedimethanol residue and the dicarboxylic acid residue includes an isophthalic acid residue and a terephthalic acid residue, wherein an amount of the isophthalic acid residue is 0 to 20 mol % when a total amount of the dicarboxylic acid residue is considered as 100 mol %, wherein an amount of the cyclohexanedimethanol residue is 50 to 100 mol % when a total amount of the diol residue is considered as 100 mol %, wherein the polyester resin composition includes an antioxidant, and wherein the antioxidant includes a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant.

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Suwon-si, South Korea

Byeong Jae Lim