Fairchild Korea Semiconductor Ltd.

Byeong Gon Kim

Eul-bin Im

Gi-young Jeon

O-seob Jeon

Seung-Yong Choi

Seung-Won Lim

Eun-Ho Lee

Seung-jin Kim

A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.

Stacked intelligent power module package

A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.

Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof

Growing community of inventors

Buchon, South Korea

Byeong Gon Kim