Lumens Co., Ltd.

Byeong Geon Kim

Seung Hyun Oh

Jung Hyun Park

Sung Sik Jo

Pyoung Gug Kim

Ho Joong Lim

Jae Yoon Lim

Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting device and a lower surface of the first wavelength converting layer.

Growing community of inventors

Yongin-si, South Korea

Byeong Geon Kim