Lg Innotek Co., Ltd.

Lg Semicon Co., Ltd.

Byeong Duck Lee

Bong Kul Min

Gam Gon Kim

Byeong Hwang Min

A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.

Light-emitting element package having lead frame with connection portion

An improved lead frame with a pre-mold paddle for a semiconductor chip package which prevents delamination and cracking between a mold body and the pre-mold paddle on which a semiconductor chip in the semiconductor chip package is placed.

Growing community of inventors

Seoul, South Korea

Byeong Duck Lee