Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Byeong-cheon Koh

Sang-on Choi

Kyung-won Na

Won-youl Choi

Myung-sam Kang

Keon-yang Park

Soon-kyo Hong

Sung-jin Lee

Seong-hoon Kim

Byoung-young Bae

Eun Sung Lee

Chang-youl Moon

Kukjin Chun

A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number '8'. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

Fluxgate sensor integrated in printed circuit board and method for manufacturing the same

A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type(or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number '8'. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

Fluxgate sensor integrated having pick-up coil mounted on excitation coil in printed circuit board and method for manufacturing the same

A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number '8' pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

Fabricating method for a fluxgate sensor integrated in printed circuit board

Fluxgate sensor integrated having stacked magnetic cores in printed circuit board and method for manufacturing the same

A side-bonding method of a flip-chip semiconductor device, a MEMS device package and a package method using the same, in which firm bonding and insensitivity to surface roughness may be obtained, include forming a UBM on a bonding line of a lower substrate having a semiconductor device formed thereon, plating solder on the UBM on the lower substrate, forming a trench in the upper substrate to contact the lower substrate at a location corresponding to a location of the solder and forming a second UBM in the trench, coupling the upper substrate and the lower substrate by inserting the solder into the trench, and heating the upper substrate and the lower substrate at a temperature higher than a melting point of the solder so that the solder is wetted toward sides of the trench to bond the upper substrate and the lower substrate.

Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same

A noise damping device for a rotating body and a disk player is disclosed. The noise damping device for a rotating body is characterized in that inner surfaces of a housing in which the rotating body is installed are provided with an intaglio and/or cameo pattern of a predetermined shape. The pattern guides the air flow within the housing smoothly, and damps noise. Also, the noise damping device for a disk player is characterized in that an intaglio and/or cameo pattern of a predetermined shape is formed on surfaces of a disk tray and/or a clamping member.

Noise damping device for rotating body and disk player

Noise damping device of rotation driving apparatus

A radiation apparatus of a hard disk drive includes a base frame, a spindle motor installed at the base frame, a hard disk rotatably supported by a rotation shaft of the spindle motor, a cover frame coupled to the base frame and having a hole formed therein, a radiation plate installed at the cover frame and formed of a copper alloy having a thermal conductivity higher than that of the cover frame, and a portion for coupling the rotation shaft and the radiation plate so that driving heat generated by the spindle motor can be directly transferred to the radiation plate.

Growing community of inventors

Sungnam, South Korea

Byeong-cheon Koh