International Business Machines Corporation

Other

Burtran Joe Cayson

John M Lauffer

Richard A Schumacher

Issa S Mahmoud

Voya Rista Markovich

Kostas I Papathomas

Christina Marie Boyko

Joseph Duane Kulesza

Joseph Gene Sabia

Roy Lynn Arldt

Philip Chihchau Liu

Richard Michael Kozlowski

James Francis Muska

Steven A Duncan

John A Covert

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

Via fill compositions for direct attach of devices and methods for applying same

Via fill compositions for direct attach of devices and methods of

Via fill compositions for direct attach of devices and methods for

Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another.

Method of reworking circuit panels, and circuit panels reworked thereby

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Austin, TX, United States of America

Burtran Joe Cayson