The Perkin-elmer Corporation

Burke E Nelson

Carlo F La Fiandra

Douglas F Baker

Means and methods are provided for controlling the geometry changes in a wafer or mask to permit patterns on the wafer to be matched with projected patterns from the mask. A sealed chamber is provided to receive the edges of the wafer or mask. Pressure is applied from a pressure source into the chamber against the edges of the wafer or mask uniformly in all directions to produce compressive strains until the desired wafer or mask geometry is obtained.

Technique to modify wafer geometry

A system for machining a glass workpiece comprises means for rotating the workpiece. A concentrated beam of energy is axially directed to the surface of the workpiece to soften the glass material. The softened glass material is then removed by a pointed or relatively narrow tool which is precisely located with respect to the area treated by the energy beam.

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Ridgefield, CT, United States of America

Burke E Nelson